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MIL-PRF-50884 Printed Wiring Board, Flexible Or Rigid-Flex, General Specification ForThis specification establishes the performance and qualification requirements for flexible and rigid-flex printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(appendix A or appendix B\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL­PRF­50884F
APPENDIX A
PRODUCT ASSURANCE (PERFORMANCE AND VERIFICATION) REQUIREMENTS
FOR QUALIFIED PRODUCTS LIST LEVEL
A.1 SCOPE
A.1.1 Scope. This appendix contains the requirements and procedures for manufacturers using the traditional
Qualified Products List (QPL) method of product assurance (performance and verification inspection) for printed
wiring boards covered by this specification. The information contained herein is intended for compliance.
A.2 APPLICABLE DOCUMENTS
A.2.1 General. The documents listed in this section are specified in sections A.3 and A.4 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirement documents cited in sections A.3 and A.4 of this
specification, whether or not they are listed.
A.2.2 Government documents. The following specification forms a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
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Printed Circuit Board/Printed Wiring Board, General Specification for.
(Copies of this document are available online at https://quicksearch.dla.mil.)
A.2.3 Non­Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
ASTM INTERNATIONAL (ASTM)
ASTM B567
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Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter
Method.
ASTM B568
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Standard Test Method for Measurement of Coating Thickness by X-Ray Spectrometry.
(Copies of these documents are available online at https://www.astm.org.)
IPC ­ ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)
IPC­2221
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Generic Standard on Printed Board Design.
IPC­2223
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Sectional Design Standard for Flexible Printed Boards.
IPC­A­600
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Acceptability of Printed Boards.
IPC­OI­645
­
Standard for Visual Optical Inspection Aids.
­
Test Methods Manual.
IPC­7095
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Design and Assembly Process Implementation for BGAs.
IPC­9252
­
Requirements for Electrical Testing of Unpopulated Printed Boards.
J­STD­003
­
Solderability Tests for Printed Boards.
(Copies of these documents are available online at https://www.ipc.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational
services.)
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