MIL-PRF-50884 Printed Wiring Board, Flexible Or Rigid-Flex, General Specification ForThis specification establishes the performance and qualification requirements for flexible and rigid-flex printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(appendix A or appendix B\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�50884F

CONTENTS

PARAGRAPH

PAGE

A.7 DEFINITIONS ..................................................................................................................................................... 58

A.7.1 Base material types...................................................................................................................................... 58

A.7.2 Complex (as related to group B testing)....................................................................................................... 58

A.7.3 Conductive interfaces................................................................................................................................... 59

A.7.3.1 External conductive interfaces ............................................................................................................... 59

A.7.3.2 Internal conductive interfaces ................................................................................................................ 59

A.7.4 Contract services ......................................................................................................................................... 59

A.7.4.1 Mass lamination..................................................................................................................................... 59

A.7.5 Cover material.............................................................................................................................................. 59

A.7.5.1 Covercoat .............................................................................................................................................. 59

A.7.5.2 Coverfilm ............................................................................................................................................... 59

A.7.5.3 Coverlay ................................................................................................................................................ 59

A.7.6 Inspection panel ........................................................................................................................................... 59

A.7.7 Printed wiring board test specimen .............................................................................................................. 59

A.7.8 Procedure .................................................................................................................................................... 59

A.7.9 Resin systems families................................................................................................................................. 60

A.7.9.1 Thermosetting resin ............................................................................................................................... 60

A.7.9.2 Thermoplastic resin ............................................................................................................................... 60

A.7.10 Printed wiring board thickness ................................................................................................................... 60

A.7.11 Quality conformance test circuitry .............................................................................................................. 60

A.7.12 As-received condition (microsection) ......................................................................................................... 60

A.7.13 Fold cycle ................................................................................................................................................... 60

A.7.14 Soda strawing (solder mask)...................................................................................................................... 60

A.7.15 Traceability code ........................................................................................................................................ 60

A.7.16 Qualified Products Database Supplemental Information Sheet ................................................................. 60

A.7.17 Supporting data.......................................................................................................................................... 60

A.7.18 First piece produced design inspection ...................................................................................................... 60

A.7.19 Referee testing........................................................................................................................................... 60

PRODUCT ASSURANCE REQUIREMENTS FOR QUALIFIED MANUFACTURER LIST LEVEL ............................ 61

B.1 SCOPE ............................................................................................................................................................... 61

B.1.1 Scope........................................................................................................................................................... 61

B.2 APPLICABLE DOCUMENTS .............................................................................................................................. 61

B.2.1 General ........................................................................................................................................................ 61

B.2.2 Government documents............................................................................................................................... 61

B.2.2.1 Specifications, standards, and handbooks ............................................................................................ 61

B.2.3 Order of precedence .................................................................................................................................... 61

B.3 REQUIREMENTS ............................................................................................................................................... 61

B.3.1 Performance requirements........................................................................................................................... 61

B.3.2 Accept/reject criteria..................................................................................................................................... 61

B.3.3 QML brand ................................................................................................................................................... 61

B.4 VERIFICATION................................................................................................................................................... 62

B.4.1 Qualification inspection ................................................................................................................................ 62

B.4.1 QML product assurance............................................................................................................................... 62

B.4.2 Printed wiring board performance verification .............................................................................................. 62

B.5 PACKAGING ...................................................................................................................................................... 62

B.5.1 Packaging .................................................................................................................................................... 62