MILPRF50884F
APPENDIX A
A.7.9 Resin systems families.
A.7.9.1 Thermosetting resin. For the purposes of this document, the following base material types are classified
as containing thermosetting resins: AF, BF, BI, GB, GC, GF, GH, GI, GM, QI, and SC.
A.7.9.2 Thermoplastic resin. For the purposes of this document, the following base material types are classified as
containing thermoplastic resin: GR, GP, GT, GX, and GY.
A.7.10 Printed wiring board thickness. The overall printed wiring board thickness includes metallic depositions,
fusing, and solder mask. The overall thickness is measured across the printed wiring board extremities (thickest
part), unless a critical area, such an edge card connector or card guide mounting location, is identified on the master
drawing.
A.7.11 Quality conformance test circuitry (QCTC). See IPCT50.
A.7.12 Non-stressed specimens (as-received condition) microsection. Non-stressed specimens means after tin-
lead is reflowed or fused or after solder coating but prior to solder float thermal stress, rework simulation, thermal
shock or bond strength testing.
A.7.13 Fold cycle. A fold cycle can be defined as either of the following:
a.
A fold cycle is defined as taking one end of the specimen and folding it around a mandrel and then unfold
back to the original starting position, traveling 180 degrees in one direction and 180 degrees in the opposite
direction.
b.
A fold cycle may also be defined as folding (using opposite ends) the ends toward each other (fold the same
direction) and then unfold back to the original starting position, with each end traveling 90 degrees in one
direction and 90 degrees in the opposite direction.
A.7.14 Soda strawing (solder mask). A long tubular-like void along the edges of conductive patterns where the
solder mask is not bonded to the base material surface or the edge of the conductor. Tin-lead fusing fluxes, fusing
oils, solder fluxes, cleaning agents or volatile materials may be trapped in the soda straw void.
A.7.15 Traceability code. The manufacturer defined traceability code is used to ensure traceability between the
printed wiring boards and the quality conformance test circuitry that represent them for manufacturing history.
A.7.16 Qualified Products Database Supplemental Information Sheet (QPDSIS). The DLA Land and MaritimeVQ
QPDSIS is an electronic file that is available from the DLA Land and MaritimeVQ web site to provide users and
customers with additional qualification details and serve as a support document to the official online QPD. The
QPDSIS can be viewed or downloaded at URL:
A.7.17 Supporting data. Data or information to provide backup and depth to required inspections or verifications.
A.7.18 First piece produced design inspection (first article). The analysis of the first item manufactured in a
production run to verify correct setup and process alignment.
A.7.19 Referee testing. The re-inspection or testing of a printed board attribute for the purpose of resolving an
acceptance issue at the request of the acquiring activity, manufacturer, or the qualifying activity.
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