MILPRF50884F
1.2.6 Wrap plating (surface and knee continuous copper plating). The wrap plating grade designation is defined
by the amount of plated-through hole surface and knee continuous copper plating thickness remaining after surface
processing. The grades are as follows:
A
Printed boards of this grade have 80 percent or more of the specified wrap plating thickness after
surface processing.
B
Printed boards of this grade have 50 percent or more of the specified wrap plating thickness after
surface processing.
C
Printed boards of this grade have 20 percent or more of the specified wrap plating thickness after
surface processing.
Unless otherwise specified, the default grade of wrap copper plating is grade A for printed board designs that will not
undergo planarization and grade B for designs that require planarization.
1.3 Description of this specification. The main body contains general provisions and is supplemented by detailed
appendices. Appendices A and B describe the two product assurance programs that can be implemented by the
manufacturer. Appendix A contains the legacy QPL product assurance program. Appendix B is an optional quality
management approach using a technical review board concept addressed in MILPRF31032, to modify the
performance and verification criteria provided in this specification. Appendix C provides statistical sampling, and
basic test and inspection procedures. Appendix D can be used when producing printed wiring boards designed to
superseded design standards (see 6.4.1 and D.4.2). Appendix D may also be used as a guide in developing a test
plan for legacy or existing designs based on the tests and inspections of appendix A. Appendix E contains the
qualification requirements. Appendices F and G contain illustrations of the acceptable and unacceptable conditions
that are either externally or internally observable on printed wiring boards. Appendix H contains the requirements for
quality control test circuitry and is mandatory for manufacturers qualified to the QPL product assurance level of this
specification.
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirement documents cited in sections 3 and 4 of this
specification, whether or not they are listed.
2.2 NonGovernment publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)
IPCT50
Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
(DoD adopted).
(Copies of these documents are available online at https://www.ipc.org.)
(NonGovernment standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational
services.)
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