MIL-PRF-50884 Printed Wiring Board, Flexible Or Rigid-Flex, General Specification ForThis specification establishes the performance and qualification requirements for flexible and rigid-flex printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(appendix A or appendix B\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�50884F

APPENDIX D

SUPERSESSION AND USAGE OF LEGACY DESIGN STANDARDS

D.1 SCOPE

D.1.1 Scope. This appendix contains guidance concerning the supersession of legacy Department of Defense

documents such as MIL�P�50884 revision C and MIL�STD�2118. This appendix is not a mandatory part of this

specification. The information contained herein is intended for guidance only.

D.2 APPLICABLE DOCUMENTS

D.2.1 General. The documents listed in this section are specified in sections D.3 and D.4 of this specification.

This section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirement documents cited in sections D.3 and D.4 of this

specification, whether or not they are listed.

D.2.2 Non�Government publications. The following documents form a part of this document to the extent specified

herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

IPC � ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)

IPC�T�50

�

Terms and Definitions for Interconnecting and Packaging Electronic Circuits.

IPC�2221

�

Generic Standard on Printed Board Design.

IPC�2223

�

Sectional Design Standard for Flexible Printed Boards.

J�STD�003

�

Solderability Tests for Printed Boards.

(Copies of these documents are available online at https://www.ipc.org.)

(Non-Government standards and other publications are normally available from the organizations that prepare or

distribute the documents. These documents also may be available in or through libraries or other informational

services.)

D.2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the

text of this document and the references cited herein, the text of this document takes precedence. Nothing in this

document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

D.3 DEFINITIONS

D.3.1 Design standard. A document that establishes the standard practices, guidelines, and default values for

the design of printed wiring boards. Within this document, the term "design standard" is used to describe those

documents that contain the design, construction, material, and test coupon requirements and guidelines.

D.3.2 Legacy designs or documents. See D.4.1.

D.3.3 Supersession. The act of replacing a legacy document that no longer exists or is no longer supported with

a currently supported document.