MILPRF50884F
CONTENTS
PARAGRAPH
PAGE
A.4.8.4.9.1 Hole (plated-through hole) ........................................................................................................ 52
A.4.8.4.9.2 Surface or surface mount land.................................................................................................. 52
A.4.8.5.2 Circuit or plated-through hole short to metal core substrate............................................................ 53
A.4.8.6.2 Resistance to soldering heat ........................................................................................................... 54
A.5 PACKAGING ...................................................................................................................................................... 54
A.6.3.1 Transference of qualification.................................................................................................................. 55
A.6.7 Group B sample critical design details ......................................................................................................... 57
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