MILPRF50884F
APPENDIX A
A.6.12 Blind, buried, and through vias. This specification includes provisions for verifying the performance of rigid
printed wiring boards containing blind vias, buried vias, controlled depth drilled vias, laser drilled vias, low aspect ratio
blind vias, microvias, semi-blind vias, semi-buried vias, and through vias.
A.6.13 Stiffener adhesion test and requirement. This document does not include the stiffener adhesion test or
requirement contained in MILP50884C. All stiffeners are viewed as a mechanical support and total bonding of the
stiffener to the printed wiring board is not required for compliance with this document.
A.6.14 Referenced IPCTM650 test methods. The following test method numbers are referenced in this
document:
Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract.
Peel Strength of Metallic Clad Laminates.
2.5.7
Dielectric Withstanding Voltage, PWB.
A.7 DEFINITIONS
A.7.1 Base material types. Qualification of a particular flexible base material types will be extended to cover all
flexible base material types of that same family.
a.
Adhesiveless family includes all base materials that use other techniques to hold the basis metal to one or
both sides of the dielectric.
b.
Adhesive family include all base materials that rely/use an adhesive to hold the metal to both sides of the
dielectric. Note "cast" materials are considered adhesiveless.
A.7.2 Complex (as related to group B testing). Complexity of printed wiring boards will usually depend on the base
materials used; dielectric layer thickness; overall printed wiring board thickness; number of conductor layers;
conductor widths and spacings; intricacy of patterns; size, quantity, aspect ratio and positioning of plated holes;
tolerancing of any or all of the above; the presence of internal thermal planes or heat sinks, and all combinations of
the above with respect to their manufacturing difficulty, and their effects upon the consistent ability of the printed
wiring boards to meet the requirements of the periodic testing, unless otherwise specified by the contracting activity.
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