MIL-PRF-50884 Printed Wiring Board, Flexible Or Rigid-Flex, General Specification ForThis specification establishes the performance and qualification requirements for flexible and rigid-flex printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(appendix A or appendix B\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12

MIL�PRF�50884F

APPENDIX A

A.4.8.6 Environmental inspection.

A.4.8.6.1 Moisture and insulation resistance (see A.3.7.6.1). The printed wiring board test specimen shall be

tested in accordance with test method number 2.6.3 of IPC�TM�650, class 3, using test specimen preparation

method A. The initial and final resistance measurements shall be taken at 500 V dc, +25 V dc, �0 V dc).

A.4.8.6.2 Resistance to soldering heat.

A.4.8.6.2.1 Solder float thermal stress (single side, single cycle, component holes) (see A.3.7.6.2). The printed

wiring board test specimen shall be inspected for solder float thermal stress in accordance with appendix F of

MIL�PRF�31032. The following details shall apply. Printed wiring board test specimens constructed of adhesiveless

metal-clad flexible base materials shall be subjected to test condition A. Printed wiring board test specimens

constructed of adhesive flexible metal-clad base materials shall be subjected to test condition B. Printed wiring board

test specimens constructed of both adhesive and adhesiveless metal-clad flexible base materials shall be subjected

to test condition B.

A.4.8.6.3 Thermal shock (see A.3.7.6.3). The printed wiring board test specimen shall be tested in accordance

with test method number 2.6.7.2 of IPC�TM�650, test condition D.

A.5 PACKAGING

A.5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or

order (see A.6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these

personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging

requirements are maintained by the Inventory Control Point s packaging activities within the Military Service or

Defense Agency, or within the Military Service s system commands. Packaging data retrieval is available from the

managing Military Department s or Defense Agency s automated packaging files, CD�ROM products, or by

contacting the responsible packaging activity.

A.6 NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

A.6.1 Intended use. This appendix is intended to be used by manufacturers certified to the QML printed board

specification, MIL�PRF�31032 to supply product to legacy drawings.

A.6.2 Acquisition requirements.

A.6.2.1 Primary acquisition requirements. Acquisition documents should specify the following:

Title, number, revision letter (with any amendment number when applicable), and date of this specification.

Packaging requirements (see A.5.1).

Appropriate printed wiring board type (see 1.2.1), installation use (see 1.2.2), and rework capability grade

(see 1.2.3).

Title, number, revision letter (with any engineering change proposal or notice of revision number when

applicable), and date of the applicable master drawing (see A.3.1.1).