MILPRF50884F
This specification is approved for use by all Departments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification establishes the performance and qualification requirements for flexible and rigid-flex
printed wiring boards with or without plated through holes (see 6.1). Verification is accomplished through the use of
one of two methods of product assurance (appendix A or appendix B). Detail requirements, specific characteristics,
and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.
1.2 Classification. Printed wiring boards are classified by 1.2.1, 1.2.2, 1.2.3 and 1.2.6.
1.2.1 Printed wiring board type. The printed wiring boards covered by this specification are of the following types:
Type 1
Singledsided flexible printed wiring board (see 6.4.3.1) with or without shields or stiffeners.
Type 2
Doublesided flexible printed wiring board (see 6.4.3.2) with or without shields or stiffeners with or
without plated-through holes.
Type 3
Multilayer flexible printed wiring board with plated holes (see 6.4.3.3) and with or without shields
or stiffeners.
Type 4
Multilayer rigid and flexible printed wiring board with plated-through holes (see 6.4.3.4).
Type 5
Bonded rigid and/or flexible printed wiring board combinations without plated-through holes (see
6.4.3.5).
1.2.2 Installation use. The printed wiring boards covered by this specification are for the following installation uses:
Use A
Capable of withstanding flexing during installation (flex to install).
Use B
Capable of withstanding continuous flexing for the number of cycles specified (see 3.1.1).
1.2.3 Rework capability (see 6.6.1). The printed wiring boards covered by this specification are of the following
rework capability grades:
Grade R
Flexible printed wiring that is capable of withstanding at least three solder and two unsolder
operations without terminal area degradation.
Grade U
Flexible printed wiring that is capable of withstanding at least one solder operation without
terminal area degradation. This grade can only be used in electrical or electronic assemblies that
will not require an unsolder and resolder capability.
If not specified on the applicable master drawing, the default rework capability is grade R.
1.2.4 Flexible base material. The printed wiring board flexible base material type should be identified by the base
material designators of the applicable flexible base material specification as required by the master drawing (see
3.1.1).
1.2.5 Rigid base material (designs with stiffeners). The printed wiring board rigid base material type should be
identified by the base material designators of the applicable base material specification as required by the master
drawing (see 3.1.1).
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