MIL-PRF-50884 Printed Wiring Board, Flexible Or Rigid-Flex, General Specification ForThis specification establishes the performance and qualification requirements for flexible and rigid-flex printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(appendix A or appendix B\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�50884F

3.7 Qualifying activity on�site audit. Manufacturers listed on QPD�50884 will be required to undergo periodic on�

site audits of their facilities by the qualifying activity. The manufacturer shall demonstrate to the qualifying activity that

controls have been implemented to assure compliance to the requirements of this specification. The qualifying

activity reserves the right to perform on�site audits of any other facilities, such as contracted services, that the

manufacturer uses for producing printed wiring boards to this specification. The on-site audit shall verify that the

manufacturer has an effective self-audit program for both itself and for all contract service operations used in the

production of certified product.

3.8 Change effectivity. Unless otherwise specified by the preparing activity or the qualifying activity, all changes

from the previous revision of MIL�P�50884 shall become effective within 180 days after the date of publication of this

revision. If a qualified manufacturer is unable to implement the changes within the 180 day time period, additional

time shall be requested from the qualifying activity. Manufacturers that are QPL listed and have concerns regarding

possible changes to retention reporting requirements should contact the qualifying activity for clarification.

3.9 Workmanship. Printed wiring boards shall be processed in such a manner as to be uniform in quality and shall

be free from other defects that will affect life, serviceability, or appearance.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

Qualification inspection (see A.4.5 and appendix E, or B.4.1).

Inspection of product for delivery (see A.4.6 or B.4.3.a).

Periodic conformance inspection (see A.4.7 or B.4.3.b).

4.4.2 Printed wiring board performance verification.

4.2.1 QPL. The minimum requirements for printed wiring board performance verification to the QPL product

assurance level shall consist of inspections on the production printed wiring boards and the quality conformance test

circuitry or test coupons referenced in appendix A.

4.2.2 QML. The minimum requirements for printed wiring board performance verification to the QML product

assurance level shall satisfy the guidelines of appendix B.

4.3 Qualification inspection. The minimum requirements for qualification shall be as specified in appendix E.

Manufacturers qualified through appendix E may accept and certify orders to the QPL product assurance level of

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order

(see 6.2). When packaging of materiel is to be performed by DoD or in�house contractor personnel, these personnel

need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are

maintained by the Inventory Control Point's packaging activity within the Military Service or Defense Agency, or within

the Military Service s system commands. Packaging data retrieval is available from the managing Military

Department's or Defense Agency's automated packaging files, CD�ROM products, or by contacting the responsible

packaging activity.