MILPRF50884F
APPENDIX A
A.4.5.2 Failure to submit retention data. Failure to communicate with the qualifying activity within 60 calendar
days after the end of the 12 month period may result in loss of qualification. In addition, the manufacturer shall notify
the qualifying activity within 3 business days if at any time during the 12 month period that the results of periodic
inspection indicates failure of the qualified product to meet the performance requirements of this appendix.
A.4.5.3 Non-production during reporting period. In the event that there is no production of any compliant printed
wiring boards during the 12 month reporting period, the manufacturer shall certify that it retains the capabilities and
facilities necessary to produce and test the qualified product. If during two consecutive reporting periods there has
been no production of the qualified product, the manufacturer may be required, at the discretion of the qualifying
activity, to submit a representative product to partial or full re-qualification testing. For the case when the
manufacturer is listed for more than one flexible base material type on the QPL and there has been no production of
the qualified product of one or all qualified base material types, the manufacturer may be required, at the discretion of
the qualifying activity, to submit a representative product of those base material types to testing.
A.4.5.4 Requalification. Requalification is not required as long as the manufacturer maintains a listing for an
equivalent technology to be supplied to this appendix on QPD31032.
A.4.6 Inspection of product for delivery. Inspection of product for delivery shall consist of in-process and group A
inspection. Except as specified in A.4.7.1.4, delivery of printed wiring boards which have passed in-process and
group A inspection shall not be delayed pending the results of the periodic inspection. Anomalies or defects noted on
sample printed wiring boards or test coupons (or both) defined herein shall be recorded and the proper corrective
action shall be initiated. Manufacturers that are qualified to use sub-contract services are still responsible for in-
process and group A inspections and shall be subject to loss of qualification if the results of in-process and group A
inspections indicate failure of the product to meet the applicable requirements.
A.4.6.1 Inprocess inspection. Each inspection lot of printed wiring boards or panels, as applicable, shall be
inspected in accordance with table AVI. When permanent solder mask is specified (see A.3.1.1), the in-process
inspections specified in subgroups 1, 2 and 3 of table AVI shall be performed prior to solder mask application. Prior
to lamination of type 3 or 4 printed wiring boards, the in-process inspections specified in subgroup 2 of table AVI
shall be performed.
A.4.6.1.1 Inspection lot.
A.4.6.1.1.1 Subgroup 1. An inspection lot shall correspond to each production lot or each change of shift of work
force, whichever occurs first. Production lots may be grouped based on same materials, same type or types of
interfacial connections and terminations, and same processing requirements.
A.4.6.1.1.2 Subgroup 2. An inspection lot shall consist of the number of printed wiring boards fabricated from the
same materials, using the same processing procedures, produced under the same conditions within a maximum
period of 1 month and offered for inspection at one time.
A.4.6.1.2 Sample size. The number of printed wiring boards or panels to be selected from each inspection lot for
examination shall be in accordance with table AVI. All samples shall be chosen randomly.
A.4.6.1.3 Rejected lots. If an inspection lot is rejected as a result of a failure to pass the subgroup 1 tests
specified, the manufacturer shall withdraw the lot, take corrective action in connection with the cleaning materials and
procedures, reclean the lot and resubmit the lot for reinspection. Printed wiring boards shall not be acceptable if the
permanent solder mask coating has been applied to a contaminated surface. If an inspection lot is rejected for
subgroup 2 or 3 tests, the manufacturer may screen (100 percent inspection) out the defective units (printed wiring
boards or panels). Defective printed wiring boards shall not be shipped.
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