MILPRF50884F
APPENDIX A
A.7.3 Conductive interfaces. The term conductive interfaces is used to describe the junction between the hole wall
plating or coating and the surfaces of internal and external layers of metal foil. The interface between platings and
coating (electroless copper, direct metallization copper, vapor deposited copper, non-electroless electroless copper
substitutes, and electrolytic copper, whether panel or pattern plated), are also considered a conductive interface.
A.7.3.1 External conductive interfaces. An external conductive interface is considered to be the junction between
the surface copper foil and the deposited or plated copper.
A.7.3.2 Internal conductive interfaces. An internal conductive interface is considered to be the junction between
the internal layers (copper foil posts or internal layers) and the deposited or plated copper.
A.7.4 Contract services. Contract services are those services contracted or performed (or both) outside the
qualified manufacturer's immediate facility, not to include verification testing including electrical function tests.
A.7.4.1 Mass lamination. Manufacturers requesting to use contract services lamination (mass lamination) are
required to be qualified to type 4 of the same base material type requested. The qualification test specimens and
sample sizes should be specified in the qualification test plan.
A.7.5 Cover material. Cover materials are thin dielectric materials used to encapsulate circuitry.
A.7.5.1 Covercoat. Covercoats are materials that are deposited as a liquid onto the circuitry that subsequently
becomes a permanent dielectric coating.
A.7.5.2 Coverfilm. Coverfilms consist of one of the following:
a.
A homogeneous single component.
b.
Separate layers of generically similar chemistries.
c.
A composite blend of constituents.
A.7.5.3 Coverlay. Coverlay are film and adhesive made from separate layers of generically different chemistries.
A.7.6 Inspection panel. A production panel which includes a sufficient quantity of quality-conformance test circuitry
necessary to complete all qualification inspections or group A and group B verifications, as applicable. Inspection
panels may have been wholly or partially processed as a larger production panel. Separation of a production panel
into multiple inspection panels is acceptable if each of the smaller sub-panels contain a sufficient quantity of quality-
conformance test circuitry necessary to complete all qualification inspections or group A and group B verifications, as
applicable. In order for printed wiring boards to be potential compliant printed wiring boards, they would have been
fabricated on inspection panels.
A.7.7 Printed wiring board test specimen. The term 'printed wiring board test specimen' is used to describe all of
the following; production printed wiring boards, portions of production printed wiring boards, qualification test
specimens, or test coupons.
A.7.8 Procedure. A particular way of accomplishing an objective; generally refers to the method rather than the
result. Procedures are usually developed to describe the methods for implementing policy.
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