MILPRF50884F
APPENDIX A
TABLE AVII. Group A inspection Continued.
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For printed wiring board designs using permanent solder mask on the production board. If the design does not
require solder mask, then the test does not need to be performed.
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Rigidized sections or stiffener portions only.
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Test coupon "A" or "S" shall be used at the manufacturer s option.
15/
For printed wiring boards using only surface mount lands for component attachment, the surface solderability test
can be used in lieu of the hole solderability test.
16/
Test coupon "G" or "T" shall be used at the manufacturer s option.
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Types 3 and 4 printed wiring boards only. NOTE: It is assumed that both continuity and circuit shorts can be
visually verified for types 1, 2, and 5. If continuity and circuit shorts cannot be verified using visual inspection, then
the production printed wiring boards shall be tested using a sample size in accordance with appendix C, table CI,
series H.
A.4.6.2.3 Alternative to sampling inspection (first piece produced design inspection see A.7.18). In lieu of
performing sample inspections of all characteristics or parameters detailed on the master drawing, manufacturers
may use first piece produced design inspection. This type of inspection is only applicable to the criteria described in
A.4.6.2.3.1 and A.4.6.2.3.2. First item produced design inspection can be performed on the first printed wiring board
that is representative of all printed wiring boards in the production lot of the design. The use of automated inspection
technology shall be acceptable.
A.4.6.2.3.1 Board and conductor pattern features. Unless otherwise specified, the accuracy of board and
conductor pattern features may be verified by performing first piece produced design inspection on a representative
first production run part or by sampling the printed boards in the lot.
A.4.6.2.3.2 Hole pattern accuracy. Unless otherwise specified, only the holes that are specifically dimensioned on
the master drawing shall be inspected for hole pattern accuracy to meet the board dimensional requirements
specified. Unless otherwise specified, the accuracy of the hole pattern may be verified by performing first piece
produced design inspection on a representative first production run part or by sampling the printed boards in the lot.
Unless otherwise specified, the hole pattern accuracy of nonspecifically dimensioned holes, such as plated through
holes and vias, do not need to be checked as their locations are set by the design activity supplied database and are
controlled by external and internal annular ring requirements.
A.4.6.2.4 Rejected lots. If an inspection lot is rejected, the manufacturer may rework it to correct the defects and
resubmit the lot for reinspection, or screen out the defective units (if possible). Resubmitted lots shall be inspected
using tightened inspection (see appendix C). Such lots (reworked or screened) shall be clearly identified as
reinspected lots. Products which have failed any group A inspection and have not been reworked and have not
passed reinspection (as specified in this appendix) may not be delivered as compliant printed wiring boards.
A.4.6.2.5 Disposition of sample units. Sample printed wiring boards which have passed all of group A inspection
may be delivered if the inspection lot is accepted.
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