MILPRF50884F
APPENDIX A
A.4.7.2.4 Noncompliance. If one or more sample units fail to pass group C inspection, the manufacturer shall
notify the qualifying activity of such failure within 3 business days. The manufacturer shall take corrective action on
the materials or processes, or both, as warranted, and on all units of product which can be corrected and which were
manufactured under essentially the same conditions (materials, processes, and equipment) and which are
considered subject to the same failure. If the lot or lots directly represented by the group C failure have been
shipped, the manufacturer shall notify the acquiring activity of the failure and shall recall the affected lot or lots for
reinspection, if possible. All other lots represented by extension of qualification by the failed group C sample are
considered noncompliant until a sample passes group C inspection. Group A inspection and shipment of the product
shall be discontinued until corrective action, acceptable to the qualifying activity, has been taken. After the corrective
action has been taken, group C inspection shall be repeated on additional sample units (all inspections, or the
inspection which the original sample failed, at the discretion of the qualifying activity). Group A inspection may be
reinstituted; however, final acceptance and shipment shall be withheld until the group C inspection has shown that
the corrective action was successful.
A.4.7.2.5 Disposition of sample units. Sample units which have been subjected to group C shall be retained as
specified in A.3.9.
A.4.8 Methods of inspection. The following verification tests and test methods assure printed wiring board integrity
within typical operating conditions and applications. Alternate methods are allowed with prior approval by the
qualifying activity. The test methods described herein are the preferred methods and shall be the referee method in
case of dispute when alternate test methods result in differing or conflicting results.
A.4.8.1 Visual and dimensional inspection. The visual and dimensional features of the printed wiring board test
specimen shall be inspected using either test method number 2.2.1 or 2.2.2 of IPCTM650, as applicable. Unless
otherwise specified, the magnifications in table AX shall be used for the conductor width or land diameter/width of
features under inspection. Referee inspection needed to confirm a suspected defect of the specimen features shall
be accomplished at a magnification of up to 40X, as applicable to confirm the suspected defect. Characteristics not
observable through solder mask shall be evaluated prior to its application to the surface of the printed wiring board
(see A.4.6.1). Verification of printed wiring board dimensional parameters using automated inspection technology
(AOI and AXI) shall be acceptable.
TABLE AX. Inspection magnification.
Magnification 1/
Conductor width or land diameter/width
IPCOI645 grade
Standard inspection
Referee inspection
Greater than .04 inches (1.0 mm)
1.75 x
4x
IV & V
From .02 to .04 inches (0.5 to 1.0 mm)
4x
10x
V & VI
From .001 to .02 inches (0.025 to 0.5 mm)
10x
20x
VI & VII
Less than .001 inches (0.025 mm)
20x
40x
VII & VIII
1/
Referee conditions are used to verify printed wiring boards rejected at the standard inspection
magnification power. For printed wiring board designs with mixed conductor and land diameters
and widths, the greater magnification power may be used for the inspection of the entire printed
wiring board.
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