MILPRF50884F
APPENDIX A
A.4.8.1.1 Annular ring, external (see A.3.5.2.5.1). The measurement of the annular ring on external layers is from
the inside surface (within the hole) of the plated hole or unsupported hole to the outer edge of the annular ring on the
A.4.8.1.2 Overall printed wiring board thickness (see A.3.5.4). Unless otherwise specified, the overall printed
wiring board thickness measurement shall be inspected by any micrometer or by microsection in accordance with
A.4.8.1.2.1 With edge-board contacts. Unless otherwise specified, printed wiring boards with edge-board contacts
shall have the overall thickness measured from top to bottom of the printed wiring board on the final finish plated
surfaces of opposite contacts.
A.4.8.1.2.2 Without edge-board contacts. Unless otherwise specified, printed wiring boards without edge-board
contacts shall have the overall thickness measured across the board from plated copper surface to plated copper
surface not including the final finish plating.
A.4.8.1.3 Registration, external (method I) (types 1 and 2) (see A.3.5.2.7). Registration of type 1 and type 2
printed wiring boards shall be satisfied if the outer layers meet the external annular ring (see A.3.1.1 and A.3.5.2.5)
A.4.8.1.4 Solder mask thickness (see A.3.5.5.7). The measurement of the solder mask thickness shall be
inspected by any micrometer or by microsection in accordance with A.4.8.2.
A.4.8.1.5 Product identification (marking and traceability). The printed wiring board specimen shall be inspected in
accordance with test method number 2.1.8 of IPCTM650, except that the magnification shall be 1.75X (3 diopters),
minimum.
A.4.8.1.6 Alternate plating and coating measurement techniques. When a conductor surface finish plating or
coating thickness is less than .00005 inch (0.00125 mm), the verification of thickness shall be performed in
accordance with one of the following test methods:
a.
ASTM B567, measurement of thickness by the beta backscatter method.
ASTM B568, measurement of thickness by X-ray spectrometry.
b.
A.4.8.1.7 Wire bond pad surface roughness. The printed wiring board specimen shall be inspected in accordance
with test method number 2.4.15 of IPCTM650. Only the pristine area of the terminal shall be evaluated.
A.4.8.1.8 Hole size. The finished hole size and tolerance shall be verified on a sample basis across all hole sizes
applicable to the design. The number of hole size measurements needed for each hole size shall be determined by
the manufacturer. The number of holes to be sampled for each hole size present on the printed wiring board shall be
determined based on the number of holes within the population. The sampling plan used shall be documented by the
manufacturer in its product assurance plan.
A.4.8.1.9 Materials inspection. Prior to any fabrication, materials inspection shall consist of certification supported
by verification data, which verifies that the materials specified (see A.3.1.1) used in fabricating the printed wiring
boards are in accordance with the applicable referenced specifications or requirements specified. Unless otherwise
specified, verifying data does not need to be submitted to the qualifying activity or acquiring activity, but shall be
made available upon request.
A.4.8.1.10 Workmanship. The printed wiring board specimen shall be inspected in accordance with test method
number 2.1.8 of IPCTM650, except that the magnification shall be 1.75X (3 diopters), minimum.
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