MIL-PRF-50884 Printed Wiring Board, Flexible Or Rigid-Flex, General Specification ForThis specification establishes the performance and qualification requirements for flexible and rigid-flex printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(appendix A or appendix B\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�50884F

APPENDIX A

A.4.8.3 Chemical inspection.

A.4.8.3.1 Ionic contamination (by resistivity of solvent extract) (see A.3.7.3.1 and A.6.4). The printed wiring board

shall be inspected for ionic contamination in accordance with test method number 2.3.25 of IPC�TM�650.

A.4.8.3.2 Resistance to solvents (marking ink or paint) (see A.3.7.3.2). Marking ink or paint resistance to solvents

shall be inspected in accordance with test method number 2.3.4 of IPC�TM�650. The following details apply:

The marked portion of the printed wiring board test specimen shall be brushed.

After the test, the printed wiring board test specimen shall be visually inspected in accordance with A.4.8.1

for legibility of marking.

A.4.8.3.2.1 Sampling procedures and test specimens. The resistance to solvents test shall be performed either

during group A (every lot) or during group B (monthly). The minimum number of sample units tested shall be at least

one sample unit for each solution specified by the applicable test method (i.e., one sample unit for each solution

required). The printed wiring board test specimen shall be as described in appendix H.

A.4.8.4 Physical inspections.

A.4.8.4.1 Adhesion, cover material (see A.3.7.4.1). The adhesion and permanency of cured cover materials on

printed wiring board test specimens shall be determined in accordance with test method number

2.4.28.1 of IPC�TM�650, with the following details and exceptions. The printed wiring board test specimen shall be

as described in appendix H when samples are taken from production panels or table A�VI when taken from

qualification test specimens.

A.4.8.4.2 Adhesion, legend and marking (see A.3.7.4.2). The printed wiring board test specimen shall be

inspected in accordance with test method number 2.4.1.1 of IPC�TM�650. The printed wiring board test specimen

shall be as described in appendix H.

A.4.8.4.3 Adhesion, plating (see A.3.7.4.3). The printed wiring board test specimen shall be inspected in

accordance with test method number 2.4.1 of IPC�TM�650, with the following details and exceptions. When edge

board contacts are part of the conductor pattern, at least one pull shall be on the contacts. Fresh tape shall be used

for each pull. If overhang metal (slivers) breaks off and adheres to the tape, it is evidence of outgrowth, but not a

plating adhesion failure.

A.4.8.4.4 Adhesion, solder mask (see A.3.7.4.4). The printed wiring board test specimen shall be inspected for

permanency and adhesion of cured solder mask in accordance with test method number 2.4.28.1 of IPC�TM�650.

A.4.8.4.5 Bow and twist (see A.3.7.4.5). The printed wiring board test specimen shall be inspected for bow and

twist in accordance with test method number 2.4.22 of IPC�TM�650.

A.4.8.4.6 Flexibility endurance (see A.3.7.4.6). The printed wiring board test specimen shall be inspected for

flexibility endurance in accordance with test method number 2.4.3 of IPC�TM�650 with the following exceptions:

The number of test specimens to test shall be as required by A.4.7.2.2.1.

The test specimen shall be subjected to a minimum of 100,000 cycles.

The flexibility endurance test may also be performed using an alternate test-to-failure method specified in A.6.6.1.