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MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL­PRF­55110G
APPENDIX A
figure A­10 FIGURE A­10
FIGURE A­10. Wicking.
figure A­11 FIGURE A­11
NOTES:
1.
Dimensions are in inches. Millimeter equivalents are given for general information only.
2.
Typically beyond land edge most radially extended.
3.
Voids at intersection of zone A and zone B. Laminate voids greater than .003 inch (0.08 mm)
that extend into zone B are rejectable.
4.
Laminate voids are not evaluated in zone A.
FIGURE A­11. Typical plated-through hole cross section after thermal stress or rework simulation.
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