MILPRF55110G
CONTENTS
PARAGRAPH
PAGE
6.5 Definitions .......................................................................................................................................................6
6.5.1 Acquiring activity ......................................................................................................................................6
6.5.2 Design standard .......................................................................................................................................6
6.5.3 Printed wiring board types ........................................................................................................................7
6.5.3.1 Type 1 ...............................................................................................................................................7
6.5.3.2 Type 2 ...............................................................................................................................................7
6.5.3.3 Type 3 ...............................................................................................................................................7
6.5.4 Product assurance ...................................................................................................................................7
6.5.4.1 QML...................................................................................................................................................7
6.5.4.2 QPL ...................................................................................................................................................7
6.5.4.3 QPL/QML ..........................................................................................................................................7
6.5.5 QPL product assurance procedures.........................................................................................................7
6.6 Environmentally preferable materials..............................................................................................................7
6.7 Subject term (key word) listing........................................................................................................................8
6.8 Compliant printed wiring boards .....................................................................................................................8
6.9 Changes from previous issue .........................................................................................................................8
FOR QUALIFIED PRODUCTS LIST PROGRAMS ...................................................................................................9
A.1. SCOPE..........................................................................................................................................................9
A.1.1 Scope ......................................................................................................................................................9
A.2. APPLICABLE DOCUMENTS ........................................................................................................................9
A.2.1 General ....................................................................................................................................................9
A.2.1.1 Non-Government publications ...........................................................................................................9
A.2.2 Order of precedence................................................................................................................................9
A.3. REQUIREMENTS .........................................................................................................................................10
A.3.1 General ....................................................................................................................................................10
A.3.1.1 Master drawing..................................................................................................................................10
A.3.2 Qualification .............................................................................................................................................10
A.3.3 Design .....................................................................................................................................................10
A.3.3.1 Test coupons ....................................................................................................................................10
A.3.4 Material ....................................................................................................................................................10
A.3.4.1 Recycled, recovered, or environmentally preferable materials ..........................................................10
A.3.4.2 Pure tin..............................................................................................................................................10
A.3.5 External visual and dimensional requirements.........................................................................................10
A.3.5.1 Base materials ..................................................................................................................................11
A.3.5.1.1 Edges of base material ...............................................................................................................11
A.3.5.1.2 Surface imperfections .................................................................................................................11
A.3.5.1.3 Subsurface imperfections ...........................................................................................................11
A.3.5.1.3.1 Foreign inclusions ................................................................................................................11
A.3.5.1.3.2 Subsurface spots .................................................................................................................12
A.3.5.1.3.3 Measling and crazing ...........................................................................................................12
A.3.5.2 Conductor pattern .............................................................................................................................12
A.3.5.2.1 Annular ring, external..................................................................................................................12
A.3.5.2.2 Conductor spacing......................................................................................................................12
A.3.5.2.3 Conductor width..........................................................................................................................12
A.3.5.2.4 Conductor pattern imperfections.................................................................................................12
A.3.5.2.5 Conductor width reduction ..........................................................................................................12
A.3.5.2.6 Conductor finish coverage ..........................................................................................................12
A.3.5.2.7 Solderable surface mount lands and wire bond pads .................................................................12
A.3.5.3 Dimensions of features .....................................................................................................................12
A.3.5.4 Hole pattern accuracy .......................................................................................................................13
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