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MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL­PRF­55110G
CONTENTS
PARAGRAPH
PAGE
A.3.5.5 Lifted lands........................................................................................................................................13
A.3.5.6 Registration, external (method I) .......................................................................................................13
A.3.5.7 Solder resist ......................................................................................................................................13
A.3.5.7.1 Coverage ....................................................................................................................................13
A.3.5.7.2 Discoloration ...............................................................................................................................13
A.3.5.7.3 Registration ................................................................................................................................13
A.3.5.7.4 Thickness ...................................................................................................................................14
A.3.5.7.5 Solder resist cure........................................................................................................................14
A.3.6 Plated hole requirements .........................................................................................................................14
A.3.6.1 Annular ring, internal .........................................................................................................................14
A.3.6.2 Minimum external conductor thickness (types 2 and 3).....................................................................14
A.3.6.3 Minimum internal conductor thickness (type 3) and external thickness (type 1) ................................14
A.3.6.4 Dielectric layer thickness...................................................................................................................14
A.3.6.4.1 Heatsink planes ..........................................................................................................................14
A.3.6.5 Delamination .....................................................................................................................................15
A.3.6.6 Etchback or smear removal (type 3) .................................................................................................15
A.3.6.6.1 Etchback.....................................................................................................................................15
A.3.6.6.2 Smear removal (hole cleaning) ...................................................................................................15
A.3.6.6.3 Wicking .......................................................................................................................................15
A.3.6.7 Laminate (base material) voids .........................................................................................................15
A.3.6.7.1 As received condition..................................................................................................................15
A.3.6.7.2 After rework simulation, thermal shock or thermal stress testing ................................................15
A.3.6.8 Lifted lands........................................................................................................................................15
A.3.6.8.1 As received condition..................................................................................................................15
A.3.6.8.2 After rework simulation, thermal stress or thermal shock testing ................................................15
A.3.6.9 Plating and coating properties ...........................................................................................................16
A.3.6.9.1 Plating and coating thickness .....................................................................................................16
A.3.6.9.2 Copper plating thickness ............................................................................................................16
A.3.6.9.3 Copper plating defects................................................................................................................16
A.3.6.9.3.1 Copper plating voids ............................................................................................................16
A.3.6.9.4 Plating separations .....................................................................................................................16
A.3.6.10 Heatsink planes...............................................................................................................................17
A.3.6.11 Plated hole wall deficiencies ...........................................................................................................17
A.3.6.12 Metallic cracks.................................................................................................................................17
A.3.6.13 Nail-heading ....................................................................................................................................17
A.3.6.14 Resin recession...............................................................................................................................17
A.3.6.14.1 As received specimens.............................................................................................................17
A.3.6.14.2 Stressed specimens (after rework simulation, thermal shock or thermal stress testing) ...........17
A.3.6.15 Undercutting....................................................................................................................................17
A.3.7 Inspection requirements ..........................................................................................................................17
A.3.7.1 Acceptability (of printed wiring boards)..............................................................................................17
A.3.7.2 Microsection evaluation.....................................................................................................................17
A.3.7.2.1 As received printed wiring board test specimens........................................................................17
A.3.7.2.2 Registration, internal...................................................................................................................17
A.3.7.2.2.1 Method II ..............................................................................................................................17
A.3.7.2.2.2 Method III .............................................................................................................................17
A.3.7.3 Chemical requirements .....................................................................................................................18
A.3.7.3.1 Cleanliness .................................................................................................................................18
A.3.7.3.1.1 Prior to the application of solder resist and qualification ......................................................18
A.3.7.3.1.2 Completed printed wiring boards..........................................................................................18
A.3.7.3.2 Resistance to solvents................................................................................................................18
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