MILPRF55110G
CONTENTS
PARAGRAPH
PAGE
A.4.5.3 Inspection routines ............................................................................................................................23
A.4.5.3.1 Manufacturer test routine............................................................................................................23
A.4.5.3.2 Certified suitable laboratory test routine .....................................................................................23
A.4.5.3.3 Contract services ........................................................................................................................23
A.4.5.3.4 Qualification rejection .................................................................................................................23
A.4.5.4 Extent of qualification ........................................................................................................................23
A.4.5.4.1 Printed wiring board type ............................................................................................................23
A.4.5.4.2 Base material types ....................................................................................................................25
A.4.5.4.3 Mass lamination..........................................................................................................................25
A.4.5.4.4 Solder resist................................................................................................................................25
A.4.5.4.5 Processes...................................................................................................................................25
A.4.5.4.5.1 Etchback ..............................................................................................................................25
A.4.5.4.5.2 Process changes .................................................................................................................25
A.4.5.5 Retention of qualification ...................................................................................................................26
A.4.5.5.1 Requalification ............................................................................................................................26
A.4.5.5.2 Product assurance procedures ...................................................................................................26
A.4.6 Inspection of product for delivery .............................................................................................................27
A.4.6.1 In-process inspection ........................................................................................................................27
A.4.6.1.1 Inspection lot ..............................................................................................................................27
A.4.6.1.1.1 Subgroup 1 ..........................................................................................................................27
A.4.6.1.1.2 Subgroups 2 and 3...............................................................................................................27
A.4.6.1.2 Sample size ................................................................................................................................27
A.4.6.1.3 Rejected lots...............................................................................................................................28
A.4.6.1.4 Materials inspection ....................................................................................................................28
A.4.6.2 Group A inspection............................................................................................................................28
A.4.6.2.1 Inspection lot ..............................................................................................................................28
A.4.6.2.2 Sampling procedures..................................................................................................................28
A.4.6.2.3 Rejected lots...............................................................................................................................29
A.4.6.2.4 Disposition of sample units .........................................................................................................29
A.4.7 Periodic conformance inspection .............................................................................................................31
A.4.7.1 Group B inspection............................................................................................................................31
A.4.7.1.1 Inspection lot ..............................................................................................................................31
A.4.7.1.2 Sampling procedures..................................................................................................................31
A.4.7.1.3 Frequency...................................................................................................................................32
A.4.7.1.4 Failures.......................................................................................................................................32
A.4.7.1.4.1 Corrective actions ................................................................................................................32
A.4.7.1.4.2 Noncompliance ....................................................................................................................32
A.4.7.1.4.3 Reinstitution of group A inspection.......................................................................................32
A.4.7.1.5 Disposition of sample units .........................................................................................................32
A.4.8 Methods of inspection ..............................................................................................................................33
A.4.8.1 Acceptability inspection .....................................................................................................................33
A.4.8.1.1 Annular ring, external..................................................................................................................33
A.4.8.1.2 Overall printed board thickness ..................................................................................................33
A.4.8.1.2.1 With edge board contacts ....................................................................................................33
A.4.8.1.2.2 Without edge board contacts ...............................................................................................33
A.4.8.1.3 Registration (method I) ...............................................................................................................33
A.4.8.1.4 Solder resist thickness................................................................................................................33
A.4.8.1.5 Workmanship..............................................................................................................................33
A.4.8.2 Microsection inspection .....................................................................................................................33
A.4.8.2.1 Microsection preparation ............................................................................................................33
A.4.8.2.2 Microsection examination and inspection ...................................................................................34
A.4.8.2.3 Plated hole inspection.................................................................................................................34
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