MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11

MIL�PRF�55110G

APPENDIX A

A.4.6.1.3

A.4.6.1.3 Rejected lots. If an inspection lot is rejected as a result of a failure to pass the subgroup 1 tests

specified, the manufacturer shall withdraw the lot, take corrective action in connection with the cleaning materials and

procedures, reclean the lot prior to application of permanent solder resist coating, and resubmit the lot for inspection.

Printed wiring boards are not acceptable if the permanent solder resist coating has been applied to a contaminated

surface. If an inspection lot is rejected for subgroup 2 or 3 tests, the manufacturer may screen (100 percent

inspection) out the defective units (printed wiring boards or panels). Defective printed wiring boards shall not be

shipped.

A.4.6.1.4

A.4.6.1.4 Materials inspection. Materials inspection shall consist of certification supported by verifying data that

the materials used in fabricating the printed wiring boards are in accordance with the applicable referenced

specifications or requirements specified (see A.3.1.1), prior to such fabrication. Unless otherwise specified (see

A.3.1.1), verifying data need not be submitted to the qualifying activity or acquiring activity, but shall be made

available upon request.

A.4.6.2

A.4.6.2 Group A inspection. Group A inspection shall consist of the inspections specified in table A�IV. The

qualified manufacturer shall be responsible for completion of all group A inspections and shall be subject to loss of

qualification for failure to complete all group A tests and inspections.

A.4.6.2.1

A.4.6.2.1 Inspection lot. A group A inspection lot shall consist of the number of printed wiring boards fabricated

from the same materials, using the same processing procedures, produced under the same conditions within a

maximum period of 1 month and offered for inspection at one time.

A.4.6.2.2

A.4.6.2.2 Sampling procedures. Statistical sampling and inspection shall be in accordance with appendix C. For

100 percent inspection, all rejected units (printed wiring boards or panels of printed wiring boards) shall not be

supplied on the contract. The following details on panel/test coupon sampling shall apply:

As received (see A.3.7.2.1):

(1) Types 1 and 2: The number of test coupons to be microsectioned shall be based on a statistical sample

of panels in the lot in accordance with appendix C, table C�I, series L.

(2) Type 3: One test coupon per panel shall be microsectioned and inspected (see A.4.6.2.2.d). The

orientation of the section shall be orthogonal to the "thermal stress" microsection.

Solderabilty (see A.3.7.4.5): For printed wiring board using only surface mount (SMT) components, the

surface solderability test can be used in lieu of the hole solderability test. For mixed component designs

(both SMT and through hole attachment), unless otherwise specified, only the hole solderability test

shall be performed.

(1) For sequential electrochemical reduction analysis (SERA), samples shall be selected in accordance with

(2) For J-STD-003, class 3, the samples shall be selected in accordance with table A�IV and appendix C,

table C�I, series L. A minimum of 30 holes need to be tested and inspected to comply with the

requirements of J-STD-003.