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MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL­PRF­55110G
APPENDIX A
table A­IV TABLE A­IV
TABLE A­IV. Group A inspection.
Test specimen 1/
Requirement
Method
Sample plans 2/
Inspection
paragraph
paragraph
T1
T2
T3
Visual and dimensional
Acceptability 3/ 4/
PWB
Plan BH 3/ 4/
PWB
PWB
Registration, external
5/
5/
Plan TJ see 6/
Microsection
As received
See 6/
A or B
B
Registration, internal
See 6/ and 7/
Chemical
Resistance to solvents
8/
8/
8/
See 8/
Physical
Bow and twist
Plan BH
PWB
PWB
PWB
Conductor edge outgrowth
Plan BH
PWB
PWB
PWB
Plating adhesion
Plan BH/TJ 3/ 9/
C
C
PWB
Solderability 6/ 9/
Hole
A or S
A or S
See 6/ & 10/
Surface
C
C
PWB
Plan BH/TJ 6/ 11/
Solder resist adhesion
G
Plan TJ
Thermal stress
A&B
B
See 6/
Electrical
Circuit continuity
100 percent 12/
PWB
PWB
PWB
Circuit shorts
PWB
PWB
PWB
100 percent 12/
1/
T1 designates a type 1 design; T2 designates a type 2 design; T3 designates a type 3 design; and PWB means
inspect the entire board, whereas an individual test coupon designation means inspect the specified test coupon.
See appendix D herein for test coupon identification (name) translation to the applicable design standard.
2/
See appendix C, table C­I for C = 0 sampling plans and C.4.5 for examples.
3/
Some attributes may need to be inspected prior to lamination or solder resist application.
4/
The solder resist thickness test can be performed on either a test coupon at a sampling of TJ or production printed
wiring board at a sampling of BH, manufacturer's option.
5/
Test coupon or production printed wiring board, manufacturer's option.
6/
See A.4.6.2.2 for sample size and test specimen description.
7/
Optional method by designated registration test coupons (method III), see A.4.8.2.4.2 for test specimen description
and sample size.
8/
See A.4.8.3.2.1 for test specimen description and sample size.
9/
This inspection does not need to be performed on solder coated printed boards.
10/
A or S test coupon, manufacturer's option.
11/
For printed wiring boards using only surface mount lands for component attachment, the surface solderability test
can be used in lieu of the hole solderability test.
12/
Type 2 and 3 printed wiring boards only.
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