An Integrated Publishing, Inc. Site

An Integrated Publishing Website

MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11

MIL�PRF�55110G

APPENDIX D

Appendix D appendix D D

SUPERSESSION, VERIFICATION CONFORMANCE INSPECTION OPTIONS,

AND USAGE OF PAST DESIGN STANDARDS

D.1

D.1. SCOPE

D.1.1

D.1.1 Scope. This appendix contains information and guidance concerning the supersession of legacy

Department of Defense documents such as MIL-P-55110, revisions C, D, and E and MIL-STD-275, revisions D and

E. This appendix is not a mandatory part of this specification. The information contained herein is intended for

guidance only.

D.2

D.2. APPLICABLE DOCUMENTS

D.2.1

D.2.1 General. The documents listed in this section are specified in sections D.3 and D.4 of this specification.

This section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirements of documents cited in sections D.3 or D.4 of this

specification, whether or not they are listed.

D.2.2

D.2.2 Non-Government publications. The following documents form a part of this document to the extent

specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or

contract.

IPC � ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)

IPC-T-50

�

Interconnecting and Packaging Electronic Circuits, Terms and Definitions.

IPC-D-275

�

Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies.

IPC-2221

�

Printed Board Design, Generic Standard for.

IPC-2222

�

Sectional Design Standard for Rigid Organic Printed Boards.

(Application for copies should be addressed to the IPC � Association Connecting Electronics Industry, 3000

Lakeside Drive, Suite 309 S, Bannockburn, IL 60015�1249 or at URL https://www.ipc.org.)

(Non-Government standards and other publications are normally available from the organizations that prepare or

distribute the documents. These documents also may be available in or through libraries or other informational

services.)

D.2.3

D.2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited

herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws

and regulations unless a specific exemption has been obtained.

D.3

D.3. DEFINITIONS

D.3.1

D.3.1 Design standard. A document that establishes the standard practices, guidelines, and default values for

the design of printed wiring boards. Within this appendix, the term "design standard" is used to describe those

documents that contain the design, construction, material, and test coupon requirements and guidelines.

D.3.2

D.3.2 Legacy designs or documents (superseded standards). See D.4.1.

D.3.3

D.3.3 Supersession. The act of replacing a legacy document that no longer exists or is no longer supported with

a currently supported document.

D.3.4

D.3.4 Quality conformance test circuitry. See IPC-T-50.