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MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL­PRF­55110G
CONTENTS
PARAGRAPH
PAGE
A.4.8.2.4 Registration ................................................................................................................................35
A.4.8.2.4.1 Method II ..............................................................................................................................35
A.4.8.2.4.2 Method III .............................................................................................................................35
A.4.8.3 Chemical inspection ..........................................................................................................................35
A.4.8.3.1 Cleanliness .................................................................................................................................35
A.4.8.3.2 Resistance to solvents................................................................................................................35
A.4.8.3.2.1 Sampling procedures and test specimens ...........................................................................35
A.4.8.4 Physical inspections ..........................................................................................................................36
A.4.8.4.1 Bow and twist..............................................................................................................................36
A.4.8.4.2 Conductor edge outgrowth .........................................................................................................36
A.4.8.4.3 Plating adhesion .........................................................................................................................36
A.4.8.4.4 Rework simulation ......................................................................................................................36
A.4.8.4.4.1 Unsupported hole.................................................................................................................36
A.4.8.4.4.2 Plated through hole ..............................................................................................................36
A.4.8.4.5 Solderability ................................................................................................................................36
A.4.8.4.5.1 Hole (plated-through hole) ...................................................................................................36
A.4.8.4.5.2 Surface or surface mount land .............................................................................................36
A.4.8.4.6 Solder resist adhesion ................................................................................................................36
A.4.8.4.7 Surface peel strength .................................................................................................................36
A.4.8.4.7.1 Test specimens .....................................................................................................................37
A.4.8.4.8 Thermal stress............................................................................................................................37
A.4.8.4.8.1 Type 1 ..................................................................................................................................37
A.4.8.4.8.2 Types 2 and 3 ......................................................................................................................37
A.4.8.5 Electrical inspection ..........................................................................................................................37
A.4.8.5.1 Circuit continuity .........................................................................................................................37
A.4.8.5.2 Circuit shorts (isolation resistance) .............................................................................................37
A.4.8.5.3 Dielectric withstanding voltage....................................................................................................37
A.4.8.6 Environmental inspection ..................................................................................................................38
A.4.8.6.1 Moisture and insulation resistance (MIR)....................................................................................38
A.4.8.6.1.1 Flush conductor printed boards............................................................................................38
A.4.8.6.2 Thermal shock ............................................................................................................................38
A.4.8.6.2.1 Thermoset base materials....................................................................................................38
A.4.8.6.2.2 Thermoplastic base materials ..............................................................................................38
A.5. PACKAGING .................................................................................................................................................38
A.5.1 Packaging ................................................................................................................................................38
A.6. NOTES..........................................................................................................................................................38
A.6.1 Intended use ............................................................................................................................................38
A.6.2 Acquisition requirements .........................................................................................................................39
A.6.2.1 Primary acquisition requirements ......................................................................................................39
A.6.2.2 Additional acquisition requirements...................................................................................................39
A.6.3 Qualification master drawings ..................................................................................................................40
A.6.3.1 Transference of qualification .............................................................................................................40
A.6.3.2 Qualification expiration and QPL 55110 ............................................................................................40
A.6.4 Cleanliness, alternate methods................................................................................................................40
A.6.5 Certified suitable laboratories ..................................................................................................................40
A.6.6 Alternate test methods .............................................................................................................................41
A.6.7 Group B sample critical design details .....................................................................................................41
A.6.8 Tin finishes ..............................................................................................................................................41
A.6.9 DSCC Form 19W.....................................................................................................................................41
A.6.10 Alternate microsection preparation procedure guidelines ......................................................................41
A.6.11 Microsection mount microetch caution...................................................................................................41
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