MILPRF55110G
APPENDIX A
A.4.8.4
A.4.8.4 Physical inspections.
A.4.8.4.1
A.4.8.4.1 Bow and twist (see A.3.7.4.1). The printed wiring board shall be inspected for bow and twist in
accordance with test method number 2.4.22 of IPC-TM-650.
A.4.8.4.2
A.4.8.4.2 Conductor edge outgrowth (see A.3.7.4.2). The extent of outgrowth, on conductors covered with metals
other than fused tin-lead or solder coating, shall be determined by measuring the conductor width before and after
mechanically removing the overhang metal. If a referee test is required, cross-sectioning of the conductor shall be
performed. The procedure for removing overhang metal, for this test, shall be as follows:
a.
Wet the printed wiring board specimen in tap water at approximately room temperature.
b.
While wet, brush the printed wiring board specimen with a brass wire brush to remove the overhang
metal. Brush in the direction of the functional line, using moderate pressure.
A.4.8.4.3
A.4.8.4.3 Plating adhesion (see A.3.7.4.3). The printed wiring board shall be tested in accordance with test
method number 2.4.1 of IPC-TM-650, with the following details and exceptions. When edge-board contacts are part
of the pattern, at least one pull shall be on the contacts. Fresh tape shall be used for each pull. If overhang metal
breaks off (slivers) and adheres to the tape, it is evidence of outgrowth (see A.3.7.4.2), but not a plating adhesion
failure.
A.4.8.4.4
A.4.8.4.4 Rework simulation.
A.4.8.4.4.1
A.4.8.4.4.1 Unsupported hole (see A.3.7.4.4.1). The printed wiring board test specimen holes shall be tested in
accordance with test method number 2.4.21 of IPC-TM-650 with the following details and exceptions: Three holes
per test coupon shall be tested. Insert wires in holes in selected lands and solder to lands by machine or hand, as
applicable. The insert wire lead shall have a diameter so that the diameter of the hole will be at a maximum of .020
inch (0.51 mm) greater than the diameter of the inserted wire lead. The wires shall not be clinched. It shall be
considered a failure when a land around an unsupported hole is loosened.
A.4.8.4.4.2
A.4.8.4.4.2 Plated through hole (see A.3.7.4.4.2). The printed wiring board test specimen plated-through holes
shall be tested in accordance with test method number 2.4.36 of IPC-TM-650, except that the rework simulation shall
be performed after stabilizing the test coupons at temperatures of 15 degrees Celsius to 35 degrees Celsius and
relative humidity of 40 to 85 percent for a period of 24 hours.
A.4.8.4.5
A.4.8.4.5 Solderability (see A.3.7.4.5).
A.4.8.4.5.1
A.4.8.4.5.1 Hole (plated-through hole) (see A.3.7.4.5.1). The printed wiring board test specimens shall be tested
A.4.8.4.5.2
A.4.8.4.5.2 Surface or surface mount land (see A.3.7.4.5.2). The printed wiring board test specimens shall be
A.4.8.4.6
A.4.8.4.6 Solder resist adhesion (see A.3.7.4.6). The permanency and adhesion of cured solder resist shall be
determined in accordance with test method number 2.4.28.1 of IPC-TM-650.
A.4.8.4.7
A.4.8.4.7 Surface peel strength (type 3 using foil lamination) (see A.3.7.4.7). The printed wiring board test
specimen shall be tested and inspected in accordance condition A of test method number 2.4.8 of IPC-TM-650.
Conditions B and C (after thermal stress and after exposure to processing chemicals) shall not be performed. Plated
tin-lead, solder coating, or other plated metallic resist shall be chemically removed prior to test or shall be prevented
from being deposited during manufacturing. The test specimen shall not be coated with any organic coating for test.
All peel strength readings obtained shall meet the minimum requirement.
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