MILPRF55110G
APPENDIX E
Appendix E appendix E E
SEQUENTIAL ELECTROCHEMICAL REDUCTION ANALYSIS (SERA)
SOLDERABILITY TEST
E.1
E.1. SCOPE
E.1.1
E.1.1 Scope. This test method describes the method and procedure used to evaluate oxidation levels on
solderable surfaces. The type and quantity of oxides on copper, tin, and lead surfaces have a significant impact on
solderability. The procedure involves using electrochemical reduction techniques to determine the type and quantity
of oxide on plated-through holes, attachment lands, and printed wiring board surface conductors. The SERA
solderability test method is offered as an alternative to other solderability test methods required by this document.
This test method shall not be contractually imposed upon either the contractor or sub-contractor. This appendix is
not a mandatory part of the specification. The information contained herein is intended for compliance only when
volunteered as an alternative to the other solderability test methods detailed.
E.2
E.2. APPLICABLE DOCUMENTS
E.2.1
E.2.1 General. The documents listed in this section are specified in sections E.3 and E.4 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements documents cited in sections E.3 and E.4 of this
specification, whether or not they are listed.
E.2.2
E.2.2 Government documents.
E.2.2.1
E.2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
A-A-59282
COMMERCIAL ITEM DESCRIPTION
AA59282
Chemicals, Analytical; General Specification for.
(Copies of these documents are available from the Standardization Document Order Desk, 700 Robbins Avenue,
Building 4D, Philadelphia, PA 191115094 or online at https://assist.daps.dla.mil/quicksearch/ or
E.2.2.2
E.2.2.2 Non-Government publications. The following documents form a part of this document to the extent
specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or
contract.
J-STD-004
IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)
J-STD-004
Soldering Fluxes, Requirements for.
(Application for copies should be addressed to the IPC Association Connecting Electronics Industry, 3000
Lakeside Drive, Suite 309 S, Bannockburn, IL 600151249 or at URL https://www.ipc.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational
services.)
E.2.3
E.2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable
laws and regulations unless a specific exemption has been obtained.
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