MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�55110G

CONTENTS

PARAGRAPH

PAGE

A.3.7.4 Physical requirements .......................................................................................................................18

A.3.7.4.1 Bow and twist..............................................................................................................................18

A.3.7.4.2 Conductor edge outgrowth .........................................................................................................18

A.3.7.4.2.1 Conductors covered with solder ...........................................................................................18

A.3.7.4.2.2 Conductors covered with metals other than solder ..............................................................18

A.3.7.4.3 Plating adhesion .........................................................................................................................18

A.3.7.4.4 Rework simulation ......................................................................................................................18

A.3.7.4.4.1 Type 1 with unsupported holes (bond strength) ...................................................................18

A.3.7.4.4.2 Types 2 and 3 with plated-through holes..............................................................................18

A.3.7.4.5 Solderability ................................................................................................................................19

A.3.7.4.5.1 Hole (plated through hole)....................................................................................................19

A.3.7.4.5.2 Surface or surface mount land .............................................................................................19

A.3.7.4.6 Solder resist cure and adhesion .................................................................................................19

A.3.7.4.6.1 Solder resist cure .................................................................................................................19

A.3.7.4.6.2 Solder resist adhesion..........................................................................................................19

A.3.7.4.7 Surface peel strength .................................................................................................................19

A.3.7.4.8 Thermal stress............................................................................................................................19

A.3.7.4.8.1 Type 1 ..................................................................................................................................19

A.3.7.4.8.2 Types 2 and 3 ......................................................................................................................19

A.3.7.5 Electrical requirements......................................................................................................................20

A.3.7.5.1 Circuit continuity .........................................................................................................................20

A.3.7.5.2 Circuit shorts...............................................................................................................................20

A.3.7.5.3 Dielectric withstanding voltage....................................................................................................20

A.3.7.5.4 Heatsink planes or metal core printed boards ............................................................................20

A.3.7.6 Environmental requirements .............................................................................................................20

A.3.7.6.1 Moisture and insulation resistance..............................................................................................20

A.3.7.6.1.1 Non-flush conductor printed boards .....................................................................................20

A.3.7.6.1.2 Flush conductor printed boards............................................................................................20

A.3.7.6.2 Thermal shock ............................................................................................................................20

A.3.7.6.2.1 Thermosetting resin base materials .....................................................................................20

A.3.7.6.2.2 Thermoplastic resin base materials......................................................................................20

A.3.8 Marking ....................................................................................................................................................21

A.3.9 Traceability ..............................................................................................................................................21

A.3.9.1 Quality conformance test circuitry, test coupons, and microsection mounts .....................................21

A.3.9.2 Printed board materials .....................................................................................................................21

A.3.10 Repair ....................................................................................................................................................21

A.3.1.1 Recycled, recovered, or environmentally preferable materials..............................................................21

A.3.12 Workmanship.........................................................................................................................................21

A.4. VERIFICATION .............................................................................................................................................21

A.4.1 Classification of inspections.....................................................................................................................21

A.4.2 Test and measuring equipment ...............................................................................................................21

A.4.3 Inspection conditions ...............................................................................................................................22

A.4.4 Printed wiring board performance verification ..........................................................................................22

A.4.4.1 Verifications preformed by a certified suitable laboratory ..................................................................22

A.4.5 Qualification inspection ............................................................................................................................22

A.4.5.1 Qualification eligibility ........................................................................................................................22

A.4.5.2 Samples ............................................................................................................................................22

A.4.5.2.1 Qualification test specimens .......................................................................................................22

A.4.5.2.1.1 Modifications to qualification test specimens .......................................................................23

A.4.5.2.2 Sample size ................................................................................................................................23