MILPRF55110G
APPENDIX A
A.3.7.4.5
A.3.7.4.5 Solderability. Solderability testing is applicable only on printed wiring board designs that require
soldering during circuit card assembly processes. Unless otherwise specified (see A.3.1.1), printed wiring board
designs that use compliant pin technology only for component attachment do not require solderability testing. Unless
otherwise specified (see A.3.1.1), printed wiring board designs that use surface mount components only shall be
tested for surface solderability, not hole solderability. Printed wiring board designs that use both surface mount and
through-hole mounted components shall be tested for both surface and hole solderability.
A.3.7.4.5.1
A.3.7.4.5.1 Hole (plated through hole). After undergoing the test specified in A.4.8.4.5.1, the printed wiring board
test specimen shall conform to the accept/reject criterion (good wetting, pinholes, dewetting, non-wetting, etc.)
A.3.7.4.5.2
A.3.7.4.5.2 Surface or surface mount land. After undergoing the test specified in A.4.8.4.5.2, the printed wiring
board test specimen shall conform to the accept/reject criterion (good wetting, pinholes, dewetting, non-wetting, etc.)
A.3.7.4.6
A.3.7.4.6 Solder resist cure and adhesion.
A.3.7.4.6.1
A.3.7.4.6.1 Solder resist cure. When inspected as specified in A.4.8.1, the cured solder resist shall not exhibit
tackiness, blistering, or delamination.
A.3.7.4.6.2
A.3.7.4.6.2 Solder resist adhesion. When tested as specified in A.4.8.4.6, the maximum percentage of cured
solder resist lifted from the surface of the base material, conductors, and lands of the coated printed wiring board test
specimen shall not exceed the following:
a.
Bare copper or base material: 0 percent.
b.
Gold or nickel plating: 5 percent.
c. Melting metals, including tin-lead plating or solder coating: 10 percent.
A.3.7.4.7
A.3.7.4.7 Surface peel strength (type 3 foil laminated printed wiring boards). After undergoing the test specified in
A.4.8.4.7, the surface conductor shall withstand a minimum peel strength greater than or equal to the "after thermal
stress" values for the corresponding copper foil type, profile, and weight specified by the base material specification.
This requirement is only applicable to foil laminated type 3 printed wiring boards that have surface conductors or
surface mount lands. Printed wiring boards with no external circuitry (external terminal land or pads only) do not
require peel strength testing.
A.3.7.4.8
A.3.7.4.8 Thermal stress.
A.3.7.4.8.1
A.3.7.4.8.1 Type 1. After undergoing the test specified in A.4.8.4.8.1, the printed wiring board test specimen shall
be inspected in accordance with A.4.8.1 and shall not exhibit any cracking or separation of plating and conductors,
blistering or delamination shall not exceed the limits allowed in A.3.5.1.3 and lands shall not lift in excess of that
allowed in A.3.5.5.
A.3.7.4.8.2
A.3.7.4.8.2 Types 2 and 3. After undergoing the test specified in A.4.8.4.8.2, the printed wiring board test
specimen shall be examined in accordance with A.4.8.1 and shall exhibit no blistering or delamination in excess of
that allowed in A.3.5.1.3. After meeting the visual and dimensional requirements of A.3.5, the printed wiring board
test specimen shall be microsectioned and inspected in accordance with A.4.8.2 and shall meet the requirements of
19
For Parts Inquires submit RFQ to Parts Hangar, Inc.
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business