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MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL­PRF­55110G
APPENDIX A
Appendix A appendix A Appendices A A
PRODUCT ASSURANCE (QUALIFICATION AND VERIFICATION) REQUIREMENTS
FOR QUALIFIED PRODUCTS LIST PROGRAMS
A.1
A.1. SCOPE
A.1.1
A.1.1 Scope. This appendix contains the requirements and procedures for manufacturers using the traditional QPL
method of product assurance (qualification and verification inspection) for printed wiring boards covered by this
specification. The process for extending and retaining qualification is also herein. This appendix is a mandatory part
of the specification for non-QML manufacturers. The information contained herein is intended for compliance only.
A.2
A.2. APPLICABLE DOCUMENTS
A.2.1
A.2.1 General. The documents listed in this section are specified in sections A.3, A.4, or A.5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections A.3, A.4, or A.5 of
this specification, whether or not they are listed.
A.2.1.1
A.2.1.1 Non-Government publications. The following documents form a part of this document to the extent
specified herein. Unless otherwise specified, the issues of the documents are those cited in the solicitation or
contract.
J-STD-003 IPC-2221 IPC-A-600 IPC-TM-650 IPC-9252 IPC-100041 IPC-100042 IPC-100043 IPC-100044
IPC ­ ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)
J­STD­003
­
Solderability Tests for Printed Boards.
IPC­2221
­
Printed Board Design, Generic Standard on.
IPC­A­600
­
Acceptability of Printed Boards.
­
Test Methods Manual.
IPC­9252
­
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards.
IPC­100041
­
Master Drawing for Single Sided Printed Boards.
IPC­100042
­
Master Drawing for Double Sided Printed Boards.
IPC­100043
­
Master Drawing for 10 Layer Multilayer Printed Boards.
IPC­100044
­
Master Drawing for 4 Layer Multilayer Printed Boards.
IPC­100047
­
Composite Test Pattern Basic Dimension Drawing (Ten Layers).
(Application for copies should be addressed to the IPC ­ Association Connecting Electronics Industry, 3000
Lakeside Drive, Suite 309 S, Bannockburn, IL 60015­1249 or at URL https://www.ipc.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational
services.)
A.2.2
A.2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
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