MILPRF55110G
CONTENTS
PARAGRAPH
PAGE
A.7. DEFINITIONS ...............................................................................................................................................41
A.7.1 Board thickness .......................................................................................................................................41
A.7.2 Complex (as related to group B testing) ..................................................................................................41
A.7.3 Conductive interfaces ..............................................................................................................................42
A.7.3.1 External conductive interfaces ..........................................................................................................42
A.7.3.2 Internal conductive interfaces............................................................................................................42
A.7.4 Contract service.......................................................................................................................................42
A.7.4.1 Mass lamination ................................................................................................................................42
A.7.5 Printed wiring board test specimen ..........................................................................................................42
A.7.6 Resin systems families ............................................................................................................................42
A.7.6.1 Thermoset resin ................................................................................................................................42
A.7.6.2 Thermoplastic resin ...........................................................................................................................42
A.7.7 Printed board thickness ...........................................................................................................................42
A.7.8 Quality-conformance test circuitry (QCTC) ..............................................................................................42
A.7.9 As received (microsection inspection) .....................................................................................................42
QUALIFIED MANUFACTURER LIST PROGRAMS................................................................................................53
B.1. SCOPE..........................................................................................................................................................53
B.1.1 Scope ......................................................................................................................................................53
B.2. APPLICABLE DOCUMENTS ........................................................................................................................53
B.2.1 General ....................................................................................................................................................53
B.2.2 Government documents ..........................................................................................................................53
B.2.2.1 Specifications, standards, and handbooks ........................................................................................53
B.2.3 Order of precedence................................................................................................................................53
B.3. REQUIREMENTS .........................................................................................................................................53
B.3.1 Performance requirements ......................................................................................................................53
B.3.2 Accept/reject criteria ................................................................................................................................53
B.3.3 QML brand...............................................................................................................................................53
B.4. VERIFICATION .............................................................................................................................................54
B.4.1 Qualification inspection (reciprocal qualification from MIL PRF 31032) ...................................................54
B.4.1.1 Concurrent qualification.....................................................................................................................54
B.4.1.2 Retention...........................................................................................................................................54
B.4.2 QPL/QML product assurance ..................................................................................................................54
B.4.3 Printed wiring board performance verification ..........................................................................................54
B.5. PACKAGING .................................................................................................................................................55
B.5.1 Packaging ................................................................................................................................................55
B.6. NOTES..........................................................................................................................................................55
B.6.1 Intended use ............................................................................................................................................55
B.6.2 Application of the QPL/QML product assurance level to existing requirements .......................................55
B.6.2.1 Use of existing master drawings .......................................................................................................55
B.6.2.2 Form, fit, and function .......................................................................................................................55
B.6.2.3 Certification .......................................................................................................................................55
B.6.3 Benefits of the QPL/QML product assurance level ..................................................................................55
B.6.4 Retention issues ......................................................................................................................................56
B.6.5 Certificates of compliance issues.............................................................................................................56
B.6.6 Past specification revisions......................................................................................................................56
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