MILPRF55110G
APPENDIX A
A.7.3
A.7.3 Conductive interfaces. The term conductive interfaces is used to describe the junction between the hole wall
plating or coating and the surfaces of internal and external layers of metal foil. The interface between platings and
coating (electroless copper, direct metallization copper and non-electroless electroless copper substitutes, etc., and
electrolytic copper, whether panel or pattern plated), are also considered a conductive interface.
A.7.3.1
A.7.3.1 External conductive interfaces. An external conductive interface is considered to be the junction between
the surface copper foil and the deposited or plated copper.
A.7.3.2
A.7.3.2 Internal conductive interfaces. An internal conductive interface is considered to be the junction between
the internal layers (copper foil posts or internal layers) and the deposited or plated copper.
A.7.4
A.7.4 Contract service. Contract services are those services contracted or performed (or both) outside the
qualified manufacturer's immediate facility, not to include verification testing or electrical function tests. For the
purposes of this appendix, the internal equipment/process condition applies only to those processes used to
manufacture the qualification test specimen. When applying for qualification of contracted services, the process to be
subcontracted and the company performing the contracted service shall be identified.
A.7.4.1
A.7.4.1 Mass lamination. Manufacturers requesting to use contract services lamination (mass lamination) will be
qualified to type 3 of the same base material type requested. The qualification test specimens and sample size will be
as specified in A.4.5.2.1. The qualification test specimens will be produced by the QPL manufacturer and the mass
laminator and should be representative of the subsequent production process. Printed wiring board manufacturers
using contract services are subject to the conditions of A.4.5.3.3.
A.7.5
A.7.5 Printed wiring board test specimen. The term printed wiring board test specimen is used to describe all of
the following; production printed wiring boards, qualification test specimens, or test coupons.
A.7.6
A.7.6 Resin systems families.
A.7.6.1
A.7.6.1 Thermoset resin. For the purposes of this document, base materials conforming to the following legacy
type designators are classified as containing thermosetting resins: AF, BF, AI, BI, GB, GC, GF, GH, GI, GM, QI, and
SC.
A.7.6.2
A.7.6.2 Thermoplastic resin. For the purposes of this document, base material conforming to the following legacy
type designators are classified as containing thermoplastic resin: GR, GP, GT, GX, and GY.
A.7.7
A.7.7 Printed board thickness. See "board thickness".
A.7.8
A.7.8 Qualityconformance test circuitry (QCTC). See IPC-T-50.
A.7.9
A.7.9 As received (microsection inspection). As received means after tin alloy plating is reflowed or fused or after
solder coating but prior to thermal stress, rework simulation, or thermal shock testing.
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