MILPRF55110G
IPC-T-50
IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)
IPCT50
Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
(Application for copies should be addressed to the IPC Association Connecting Electronics Industry, 3000
Lakeside Drive, Suite 309 S, Bannockburn, IL 600151249 or at URL https://www.ipc.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational
services.)
2.3
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
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3. REQUIREMENTS
3.1
3.1 General requirements. The manufacturer of printed wiring boards, in compliance with this specification, shall
have and use production facilities, verification facilities, and product assurance procedures adequate to assure
successful compliance with the provisions of this specification and the associated master drawing. Adequacy of a
printed board manufacturer to meet the requirements of this specification shall be determined by the Government
qualifying activity (Defense Supply Center, Columbus, code DSCCVQE). Only printed wiring boards which are
verified and meet all the applicable performance requirements contained herein and the design, construction, and
material requirement of the associated master drawing shall be certified as compliant and delivered.
3.1.1
3.1.1 Master drawing. Printed wiring boards delivered under this specification shall be of the material, design, and
construction specified on the applicable master drawing.
3.1.2
3.1.2 Conflicting requirements. In the event of conflict between the requirements of this specification and other
requirements of the applicable master drawing, the precedence in which documents shall govern, in descending
order, is as follows:
a.
The applicable master drawing (see 3.1.1). Additional acquisition requirements (see 6.2) may be provided in
the order or contract. Any deletion of any of the performance requirements or performance verifications of
this specification not approved by the qualifying activity, will result in the printed wiring board being deemed
noncompliant with this specification.
b.
This specification.
c.
d. Specifications, standards, and other documents referenced in section 2.
3.1.3
3.1.3 Terms and definitions. The definitions for all terms used herein shall be as specified in IPC-T-50 and those
3.2
3.2 Qualification. Printed wiring boards furnished under this specification shall be products that are authorized by
the qualifying activity for listing on the applicable QPL before contract award (see 4.3 and 6.3). In addition, the
manufacturer shall certify for QPL or receive certification from the qualifying activity for QPL/QML that the product
assurance requirements of 3.3 have been met and are being maintained.
3.2.1
3.2.1 QPL. The qualification requirements for the QPL product assurance level shall be in accordance with
appendix A.
3.2.2
3.2.2 QPL/QML. The qualification requirements for the QPL/QML product assurance level shall be in accordance
with appendix B.
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