MILPRF55110G
This specification is approved for use by all Departments and Agencies of the Department of Defense.
1
1. SCOPE
1.1
1.1 Scope. This specification establishes the performance and qualification requirements for rigid singlesided,
doublesided, and multilayered printed wiring boards with or without plated through holes (see 6.1). Verification is
accomplished through the use of one of two methods of product assurance (QPL or QPL/QML). Detail requirements,
specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the
applicable master drawing.
1.2
1.2 Classification. Printed wiring boards are classified by 1.2.1 and 1.2.2.
1.2.1
1.2.1 Type. Printed wiring boards are of the types described herein, as specified (see 3.1).
Type 1 Singled-sided printed wiring board (see 6.5.3.1).
Type 2 Doublesided printed wiring board (see 6.5.3.2) with or without plated-through holes.
Type 3 Multilayer printed wiring board with plated holes (see 6.5.3.3).
1.2.2
1.2.2 Base material. The printed wiring board base material type should be identified by the applicable base
material specification sheet or by the legacy base material type designator as required by the master drawing (see
3.1.1).
1.3
1.3 Description of this specification. The main body contains general provisions and is supplemented by detailed
appendices. Appendices A and B describe the two product assurance programs that can be implemented by the
manufacturer. Appendix A contains the traditional Qualified Products List (QPL) product assurance program.
Appendix B is an optional quality management approach using a technical review board concept along with a
Qualified Manufacturer List (QML) product assurance program addressed in MILPRF31032, to modify the generic
verification criteria provided in this specification. Appendix C provides statistical sampling, and basic test and
inspection procedures. Appendix D is optional and can be used when producing printed wiring boards designed to
superseded design standards (see 6.5.2). Appendix D may also be used as a guide in developing a test plan for
legacy or existing designs based on the tests and inspections of appendix A. Appendix E is optional and describes an
alternative procedure used to evaluate oxidation levels on solderable surfaces. The procedure involves using
electrochemical reduction techniques to determine the type and quantity of oxide on plated-through holes.
2
2. APPLICABLE DOCUMENTS
2.1
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2
2.2 Non-Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
1
For Parts Inquires submit RFQ to Parts Hangar, Inc.
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business