MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�55110G

APPENDIX A

A.4.8.6

A.4.8.6 Environmental inspection.

A.4.8.6.1

A.4.8.6.1 Moisture and insulation resistance (MIR) (see A.3.7.6.1.1). The printed wiring board test specimen shall

be tested in accordance with test method number 2.6.3 of IPC-TM-650, class 3, test specimen preparation method A

(with conformal coating). The initial and final resistance measurements shall be taken at 500 volts direct current (+25

volts direct current, �0 volts direct current).

A.4.8.6.1.1

A.4.8.6.1.1 Flush conductor printed boards (see A.3.7.6.1.2). The test specimens shall be inspected in

accordance with A.4.8.6.1, except the insulation resistance measurement shall be taken within 60 seconds after

removal of the test specimen from the humidity chamber and after 100 V direct current, +/� 15 percent has been

applied between all conductors for a minimum of 60 seconds.

A.4.8.6.2

A.4.8.6.2 Thermal shock (see A.3.7.6.2 and A.4.5.4.2).

A.4.8.6.2.1

A.4.8.6.2.1 Thermoset base materials. The printed wiring board test specimen shall be tested in accordance with

test method number 2.6.7.2 of IPC-TM-650, with the following details:

Test specimen: See table A�II.

Test condition: D, E, or F, see A.4.5.4.2.

c. Maximum change in resistance: 10 percent.

A.4.8.6.2.2

A.4.8.6.2.2 Thermoplastic base materials. The printed wiring board test specimen shall be tested in accordance

with test method number 2.6.7 of IPC-TM-650, test condition B, with the following details:

Test specimen: See table A�II.

Maximum change in resistance: 15 percent.

A.5

A.5. PACKAGING

A.5.1

A.5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or

order (see A.6.2). When actual packaging of materiel is to be performed by DoD or in house personnel, these

personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging

requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense

Agency, or within the Military Service's system commands. Packaging data retrieval is available from the managing

Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the

responsible packaging activity.

A.6

A.6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

A.6.1

A.6.1 Intended use. This appendix is intended to be used by manufacturers not certified to the QML printed board

specification, MIL-PRF-31032. This appendix is not a duplicate or look�alike of any MIL-PRF-31032 specification

sheet. Most of the historic performance and verification requirements are still contained in this appendix. However,

many of the "enhanced" acceptance criteria or verification methods developed for MIL-PRF-31032 specifications

sheet have been added as the baseline or are available as an option using appendix B.