MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�55110G

APPENDIX A

A.4.5.4.2

A.4.5.4.2 Base material types (see A.7.6). Qualification using base material (laminates) shall be as follows:

Qualification with woven glass reinforced thermosetting epoxy resin base material type FR-4 (legacy type

GF) shall be extended to cover types G-11 and FR-5 (legacy types GB and GH) of woven glass reinforced

thermosetting epoxy resin base materials.

Qualification with woven glass reinforced thermosetting polyimide resin base material type GPY (legacy type

GI) shall be extended to cover all other types of woven glass reinforced thermosetting polyimide resin base

materials.

Qualification with woven glass reinforced thermoplastic polytetrafluoroethylene resin base material types

(legacy type GR) shall be extended to cover all other types of woven glass reinforced thermoplastic resin

base materials (legacy type GP).

Qualification with non-woven glass reinforced thermoplastic polytetrafluoroethylene resin base material

types (legacy type GY) shall be extended to cover all other types of non woven glass reinforced

thermoplastic resin base materials (legacy type GT and GX).

Qualification with non-woven glass reinforced thermoplastic polytetrafluoroethylene resin base material

legacy type GX shall be extended to cover legacy type GT.

Qualification with woven glass reinforced thermosetting cyanate ester resin base materials (leagcy type GC)

shall be extended to cover all other types of woven glass reinforced thermosetting cyanate ester resin base

materials (legacy type SC).

g. Qualification using any other base materials shall qualify only that base material.

A.4.5.4.3

A.4.5.4.3 Mass lamination (see A.7.4.1). Qualification of a contract service lamination (four conductor layers) shall

be extended to cover a contract service lamination of up to four conductor layers. Qualification of a contract service

lamination (ten conductor layers) shall be extended to cover a contract service lamination of five or more conductor

layers. NOTE: Test specimens for four layer contract lamination shall meet the requirements specified in master

drawing IPC-100044. Test specimens for ten layer contract lamination shall meet the requirements specified in

master drawing IPC-100043.

A.4.5.4.4

A.4.5.4.4 Solder resist. Qualification of any printed wiring board type shall be extended to cover the approved type

with solder resist.

A.4.5.4.5

A.4.5.4.5 Processes.

A.4.5.4.5.1

A.4.5.4.5.1 Etchback. Qualification using etchback shall be extended to cover non-etchback. Manufacturer

qualifying using contract service etchback shall submit two additional qualification test specimens fabricated using

their own internal desmear process.

A.4.5.4.5.2

A.4.5.4.5.2 Process changes. Any changes to a manufacturer's qualified base material type, equipment, or

processes will be reviewed by the qualifying activity for determination if partial or full requalification is necessary.