MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�55110G

APPENDIX A

A.6.2

A.6.2 Acquisition requirements.

A.6.2.1

A.6.2.1 Primary acquisition requirements. Acquisition documents should specify the following:

Title, number, revision letter (with any amendment number when applicable), and date of this specification.

b. Appropriate type (see 1.2.1) and base material designations (see 1.2.2).

A.6.2.1.c

c. Title, number, revision letter (with any engineering change proposal or notice of revision number when

applicable), and date of the applicable master drawing (see A.3.1.1).

A.6.2.1.d

d. Title, number, revision letter (with any notice number when applicable), and date of the applicable design

standard (see A.3.3).

Part identification (if applicable), and marking instructions including size, location, and application method

Whether microsectioned test specimens, samples or photographs are required to be delivered with the

order.

g. Packaging requirements (see A.5.1).

A.6.2.2

A.6.2.2 Additional acquisition requirements. Acquisition documents should also specify the following data, if

applicable:

Verification Conformance Inspection option (if other than option 4)(see appendix D).

Design related if different than the applicable design standard (see appendix D).

(1)

Minimum annular ring (external/internal)(see A.3.1.1), if different than the applicable design standard.

Minimum conductor width (see A.3.1.1), if different than the applicable design standard.

(2)

Minimum conductor spacing (see A.3.1.1), if different than the applicable design standard.

(3)

Minimum dielectric thickness (see A.3.1.1), if different than the applicable design standard.

(4)

Minimum edge spacing requirement (see A.3.1.1), if different than the applicable design standard.

(5)

(6)

Copper plating thickness (see A.3.1.1), if different than the applicable design standard.

Conductor finish plating (see A.3.1.1), if other than solder coating or tin-lead.

(7)

Conductor edge outgrowth or overhang, if applicable (see A.3.7.4.2).

Circuit shorts (isolation resistance) requirements including minimum applied test voltage (see A.3.7.5.2 and

Surface (foil lamination) peel strength, if applicable (see A.3.7.4.7).

Non-delivery of sample units which have not been subjected to electrical testing (circuit continuity and circuit

shorts tests) and have passed all other tests to groups A and B inspection.

A.6.2.2.g

g. Cleanliness (see A.3.7.3.1 and A.6.4).

If special or other identification marking is required (see A.3.8).