MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�55110G

APPENDIX A

A.4.8.4.7.1

A.4.8.4.7.1 Test specimens. The specimen shall consist of conductors that provide a minimum test length of 2

inches (50.8 mm) and a conductor width of .125 inch (3.3 mm). NOTE: This test coupon is described in the default

design standard (test coupon "N") or number 5.8.3 of IPC-TM-650. At least one test coupon per foil laminated side

shall be placed on the production panel where space is available.

A.4.8.4.8

A.4.8.4.8 Thermal stress (see A.3.7.4.8).

A.4.8.4.8.1

A.4.8.4.8.1 Type 1 (see A.3.7.4.8.1). The printed wiring board test specimen shall be tested in accordance with

test method number 2.6.8 of IPC-TM-650 except that post evaluation microsectioning is not required.

A.4.8.4.8.2

A.4.8.4.8.2 Types 2 and 3 (see A.3.7.4.8.2). The printed wiring board test specimen shall be tested in accordance

with test method number 2.6.8 of IPC-TM-650. The following details shall apply.

Test specimens constructed of thermoset resin base materials shall be subjected to test condition A.

Test specimens constructed of aramid reinforced thermoset resin base materials shall be subjected to test

condition B. Test specimens constructed of thermoplastic resin base materials shall be subjected to test

condition C.

A.4.8.5

A.4.8.5 Electrical inspection.

A.4.8.5.1

A.4.8.5.1 Circuit continuity (see A.3.7.5.1). A current shall be passed through each net by applying electrodes on

the terminals at each end of the net. The current passed through the net shall not exceed those specified in the

applicable design standard (see A.3.1.1 and appendix D) for the smallest conductor in the circuit. See IPC-9252 for

additional guidelines.

A.4.8.5.2

A.4.8.5.2 Circuit shorts (isolation resistance) (see A.3.7.5.2). A test voltage shall be applied between each net and

all other nets that are adjacent to the net under test. The voltage shall be applied between nets of each layer and the

electrically isolated net of each adjacent layer. For manual testing, the voltage shall be 200 volts minimum and shall

be applied for a minimum of 5 seconds. When automated test equipment is used, the minimum applied test voltage

shall be as specified on the applicable master drawing. If a test voltage of the printed wiring board is not specified on

the applicable master drawing, the test voltage shall be the maximum rated voltage of the net being tested. If no

maximum rated voltage is specified, the minimum test voltage shall be 40 volts.

A.4.8.5.3

A.4.8.5.3 Dielectric withstanding voltage (see A.3.7.5.3). The printed wiring board test specimen shall be tested in

accordance with test method number 2.5.7 of IPC-TM-650, test condition B. The following details and exceptions

apply:

Test specimen: The test specimen shall be as identified in tables A�Il or A�V and shall been subjected to

the moisture and insulation resistance test.

Test specimen preparation: This portion of the test shall be skipped.

Points of application: The dielectric withstanding voltage shall be applied between all common portions of

each conductor pattern and all adjacent common portions of each conductor pattern. The voltage shall be

applied between conductor patterns of each layer and the electrically isolated pattern of each adjacent layer.