MILPRF55110G
APPENDIX A
A.3.6.10
A.3.6.10 Heatsink planes (see figure A7). Unless otherwise specified (see A.3.1.1), when heatsink planes are
used as electrically functioning circuit, they shall meet the requirements of A.3.6.9.2 through A.3.6.9.4 inclusive.
A.3.6.11
A.3.6.11 Plated hole wall deficiencies (see figure A16). Nodules, plating folds, or plated reinforcement material
fibers that project into the copper plating shall be acceptable provided that the hole diameter and the hole wall copper
thickness are not reduced below their specified limits.
A.3.6.12
A.3.6.12 Metallic cracks. There shall be no cracks in any plating, coating, or the internal layer conductive foils.
Cracks in outer layer conductive foil shall be acceptable if they do not propagate into any plating or coating. Cracks
shall not be acceptable in the copper plating.
A.3.6.13
A.3.6.13 Nail-heading. Nail-heading of conductors shall not exceed one and a half times the copper foil thickness.
A.3.6.14
A.3.6.14 Resin recession.
A.3.6.14.1
A.3.6.14.1 As received specimens. Resin recession at the outer surface of the plated hole barrel wall shall be
permitted provided the maximum depth as measured from the barrel wall does not exceed .003 inch (0.08 mm) and
the resin recession on any side of the plated-through hole does not exceed 40 percent of the cumulative base
material thickness (sum of the dielectric layer thickness being evaluated) on the side of the plated-through hole being
evaluated.
A.3.6.14.2
A.3.6.14.2 Stressed specimens (after rework simulation, thermal shock or thermal stress testing). Resin recession
at the outer surface of the plated hole barrel shall be permitted and is not cause for rejection.
A.3.6.15
A.3.6.15 Undercutting. Undercutting at each edge of the conductors shall not exceed the total thickness of the
copper foil and plated copper.
A.3.7
A.3.7 Inspection requirements. The detailed requirements contained in this section, although determined by
examination of sample printed wiring board test specimens (production printed wiring boards, test coupons, or
microsectioned test coupons), apply to all deliverable printed wiring boards.
A.3.7.1
A.3.7.1 Acceptability (of printed wiring boards). When examined as specified in A.4.8.1, the printed wiring boards
shall be in accordance with the acceptance requirements specified in A.3.1.1 (master drawing), A.3.4 (material), A.3.5
(visual and dimensional), A.3.7.4.6.1 (solder resist cure), A.3.8 (marking), A.3.10 (repair), and A.3.12 (workmanship),
as applicable.
A.3.7.2
A.3.7.2 Microsection evaluation.
A.3.7.2.1
A.3.7.2.1 As received printed wiring board test specimens. When "as received" printed wiring board test
specimens (unstressed printed wiring boards, supporting test coupons, or qualification test specimens) are examined
as specified in A.4.8.1, the requirements specified in A.3.8 and A.3.12 shall be met. After meeting the external visual
requirements, the "as received" printed wiring board test specimens shall be microsectioned and examined as
A.3.7.2.2
A.3.7.2.2 Registration, internal.
A.3.7.2.2.1
A.3.7.2.2.1 Method II (by microsection). Unless otherwise specified (see A.3.1.1), when inspected as specified in
A.4.8.2.4, registration of internal lands shall be satisfied if the internal layers meet the specified annular ring
A.3.7.2.2.2
A.3.7.2.2.2 Method III (by registration test coupons). Registration test coupons may have been designed into the
printed wiring board by the design activity, or may be added to the panel by the manufacturer to enhance testability
(see A.4.8.2.4.2 and appendix D). To be usable for acceptance purposes, registration test coupons shall relate the
actual grid location of each circuitry layer to all other circuitry layers and to the hole pattern accuracy required (see
A.3.5.4) in each printed wiring board.
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