MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�55110G

APPENDIX A

Thermal stress (see A.3.7.4.8).

(1) Type 1: The number of test coupons to be tested and inspected shall be based on a statistical sample

of panels in the lot in accordance with appendix C, table C�I, series L.

(2) Type 2: The number of test coupons to be tested and microsectioned shall be based on a statistical

sample of panels in the lot in accordance with appendix C, table C�I, series J.

(3) Type 3: A minimum of two test coupons (one A and one B) per panel shall be microsectioned and

inspected. One of the test coupons shall be microsectioned in the panel's length direction and the other

shall be microsectioned along the panel's width direction.

A.4.6.2.2.d

d. Registration (method II, type 3 only): When method II is to be used, registration shall be evaluated using any

combination of two microsectioned test specimens taken from diagonal corners of the panel. Both test

coupons shall have been microsectioned in the vertical plane with one test coupon representing the panel's

length (X) direction and the other representing the panel's width (Y) direction. Test coupons from the "as

received" (see A.3.7.2.1) or "thermal stress" (see A.3.7.4.8) verifications may be used.

NOTE: Concerning type 3 "as received" and "thermal stress" microsections, a minimum of two test coupons (one A

and one B) per panel shall be microsectioned. One of the test coupons shall be microsectioned in the panel's length

direction and the other shall be microsectioned along the panel's width direction. One of the test coupons shall

represent the "as received" condition and the other the after "thermal stress" condition.

A.4.6.2.3

A.4.6.2.3 Rejected lots. If an inspection lot is rejected, the manufacturer may rework it to correct the defects and

resubmit the lot for reinspection, or screen out the defective units (if possible). Resubmitted lots shall be inspected

using tightened inspection (see appendix C). Such lots (reworked or screened) shall be clearly identified as

reinspected lots. Products which have failed any group A inspection herein and have not been reworked and have

not passed reinspection (as specified in this appendix) may not be delivered as compliant printed wiring boards.

A.4.6.2.4

A.4.6.2.4 Disposition of sample units. Sample printed wiring boards which have passed all of group A inspection

herein may be delivered if the inspection lot is accepted.