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MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification ForThis specification establishes the performance and qualification requirements for rigid single??sided, double??sided, and multilayered printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(QPL or QPL/QML\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL­PRF­55110G
APPENDIX A
A.4.6
A.4.6 Inspection of product for delivery. Inspection of product for delivery shall consist of in-process and group A
inspection. Except as specified in A.4.7.1.4, delivery of printed wiring boards which have passed in-process and
group A inspection shall not be delayed pending the results of the periodic inspection. Anomalies or defects noted on
sample printed wiring boards or test coupons (or both) defined herein shall be recorded and the proper corrective
action shall be initiated. Manufacturers that are qualified to use contract services (see A.4.5.3.3) are still responsible
for in-process and group A inspections and shall be subject to loss of qualification for failure to complete the
in-process and group A inspections.
A.4.6.1
A.4.6.1 In-process inspection. Each inspection lot of printed wiring boards or panels, as applicable, shall be
inspected in accordance with table A­III. When permanent solder resist is specified (see A.3.1.1), the in-process
inspections specified in subgroups 1, 2, and 3 of table A­III shall be performed prior to solder resist application. Prior
to lamination of type 3 printed wiring boards, the in-process inspections specified in subgroup 2 of table A­III shall be
performed.
table A­III TABLE A­III
TABLE A­III. In-process inspection.
Requirement
Method
Sample size 1/
Inspection
paragraph
paragraph
Subgroup 1
Material
Plan BN or TL
Cleanliness 2/
Subgroup 2
Plan BH
Conductor spacing 2/ 3/
Plan BH
Conductor width 2/ 3/
Plan BH
Conductor pattern imperfections
Subgroup 3
Plan BH
Plating adhesion 2/ 4/
1/
See appendix C, table C­I for C = 0 sampling plans.
2/
Performed prior to solder resist application.
3/
Performed prior to lamination on each production lot.
4/
A non-reflowed test coupon prior to reflow may be required (see A.6.2).
A.4.6.1.1
A.4.6.1.1 Inspection lot.
A.4.6.1.1.1
A.4.6.1.1.1 Subgroup 1. An inspection lot shall correspond to each production lot or each change of shift of work
force, whichever occurs first. Production lots may be grouped based on same materials, same type or types of
interfacial connections and terminations, and same processing requirements.
A.4.6.1.1.2
A.4.6.1.1.2 Subgroups 2 and 3. An inspection lot shall consist of the number of printed wiring boards fabricated
from the same materials, using the same processing procedures, produced under the same conditions within a
maximum period of 1 month and offered for inspection at one time.
A.4.6.1.2
A.4.6.1.2 Sample size. The number of printed wiring boards or panels to be selected from each inspection lot shall
be in accordance with table A­III.
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