MIL-PRF-31032/1B
TABLE I. Lot conformance inspection.
*
Specimen to test 1/
Requirement Method
Sample plan 2/
Inspection
paragraph
paragraph
PWB
THM
SMT
MIX
Subgroup 1 (panel acceptance)
*
See 4.4.1.1 and
A&B
A&B
A&B
4.7.6.2
3.7.6.2
Thermal stress
4.4.1.2
Subgroup 2 (100 percent)
100 percent
X
4.7.5.1
3.7.5.1
Continuity
100 percent
X
4.7.5.2
3.7.5.2
Isolation (circuit shorts)
Subgroup 3a (Sample)
Plan BH
X
4.7.1
3.7.1
Acceptability 3/ 4/
Subgroup 3b (Sample)
Chemical:
Plan BN or TN 6/
X
4.7.3.1
3.7.3.1.1
Cleanliness 5/
Subgroup 3c (Sample)
Physical:
X
4.7.4.1
Plan BH or TJ 6/
3.7.4.1
Adhesion, marking
7/
7/
7/
X
4.7.4.2
3.7.4.2
Adhesion, plating 8/
C
C
C
Plan BH or TJ 6/
X
4.7.4.3
3.7.4.3
G
G 9/
G 9/
Plan BH or TJ 6/
Adhesion, solder resist
X
4.7.4.4
3.7.4.4
Plan BH
Bow and twist
Solderability
4.7.4.6
3.7.4.6.1
S or A
Plan TJ
Hole
A or S
4.7.4.6
3.7.4.6.2
C or M
Plan TJ
Surface
C or M
*
1/
Test coupons are in accordance with IPC-2221. PWB is a production board; THM is a through-hole mount test
coupon; SMT is a surface mount PWB test coupon; MIX is for printed board designs containing both through-hole
and surface mount components test coupon.
2/
See MIL-PRF-31032 for C = 0 sampling plans.
3/
Design (3.3), conductor spacing (3.5.2.5), conductor width (3.5.2.6), conductor imperfections (3.5.2.3) and
workmanship (3.9) shall be inspected on both the internal layers containing conductors prior to lamination and the
completed printed board.
4/
Surface imperfections (3.5.1.2) and subsurface imperfections (3.5.1.3) shall be inspected prior to solder resist
application.
*
5/
Inspection shall be performed prior to solder resist application. Additional inspections on completed printed
boards may be specified.
*
6/
Test coupon, production panel, or production printed board, manufacturer option.
*
7/
See 4.7.4.1 for test specimen description and quantity.
*
8/
All surface platings or coatings shall be inspected.
9/
Test coupon T shall be used when production printed boards have tented via holes.
11
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