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MIL-PRF-31032-1 Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, With Or Without Blind And Buried Plated-Through Holes, For Soldered Part MountingThis specification covers the generic performance requirements for rigid, multilayered \(three or more conductor layers\) printed wiring boards \(hereafter designated printed board\) with plated holes, that will use soldering for component/part mounting \(see 6.1.1\).

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MIL-PRF-31032/1B
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FIGURE 1. Typical plated-through hole cross section after thermal stress or rework simulation.
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