MIL-PRF-31032/1B
3.5.2.4.2 Whiskers. There shall be no whiskers of solder or other platings on the surface of the conductor pattern.
3.5.2.5 Conductor spacing. Conductor spacing shall be as specified.
3.5.2.6 Conductor width. Conductor width shall be as specified.
*
3.5.3 Dimensions. The completed printed board shall meet the dimensional requirements (such as cutouts, overall
thickness, periphery, etc.) specified.
3.5.4 Hole pattern accuracy. The size and location of the hole pattern in the printed board shall be as specified.
3.5.5 Solder resist. Unless otherwise specified, the solder resist conditions below shall apply.
*
3.5.5.1 Coverage. Solder resist coverage imperfections (such as blisters, skips, and voids) shall be acceptable
providing the following conditions are met:
a.
The solder resist imperfection shall not expose two adjacent conductors whose spacing is less than the
electrical spacing required for the voltage range and environmental condition specified in the applicable
design standard.
b.
In areas containing parallel conductors, the solder resist imperfection shall not expose two isolated
conductors whose spacing is less than 0.5 mm (.02 inch) unless one of the conductors is a test point or other
feature area which is purposely left uncoated for subsequent operations.
c.
The exposed conductor shall not be bare copper.
d.
The solder resist imperfection does not expose tented via holes.
3.5.5.2 Discoloration. Discoloration of metallic surfaces under the cured solder resist is acceptable.
3.5.5.3 Registration. The solder resist shall be registered to the land or terminal patterns in such a manner as to
meet the requirements specified. If no requirements are specified, the following apply:
a.
Unless otherwise specified, solder resist shall not encroach onto surface mount lands.
b.
Solder resist misregistration onto plated-through component hole lands (plated-through holes to which solder
connections are to be made) shall not reduce the external annular ring below the specified minimum
requirements.
c.
Solder resist shall not encroach into plated-through hole barrels or onto other surface features (such as
connector fingers or lands of unplated holes) to which solder connections will be made.
d.
Solder resist is permitted in plated-through holes or vias in which no lead is to be soldered.
e.
Test points which are intended for assembly testing shall be free of solder resist unless a partial coverage
allowance is specified.
3.5.5.4 Thickness. Solder resist thickness shall be as specified.
*
3.5.5.5 Solder resist cure. The cured solder resist coating shall not exhibit tackiness, blistering, or delamination.
4
For Parts Inquires submit RFQ to Parts Hangar, Inc.
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business