MIL-PRF-31032/1B
4.7.4 Physical test methods.
4.7.4.1 Adhesion, marking. Test specimens which represent all types of marking used on the lot (except etched
marking) shall be subjected to the solderability test in 4.7.4.8. The side of the test specimen that is marked shall be
placed against the solder. After the test, the test specimen shall be examined in accordance with 4.7.1 and the
requirements of 3.7.4.1 shall be met.
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4.7.4.2 Adhesion, plating. The test for plating adhesion shall be performed in accordance with test method number
2.4.1 of IPC-TM-650. If overhanging metal break off and adheres to the tape, it is evidence of outgrowth, overhang or
slivers, but not of plating adhesion failure.
4.7.4.3 Adhesion, solder resist. The test for solder resist adhesion shall be performed in accordance with test
method number 2.4.28.1 of IPC-TM-650.
4.7.4.4 Bow and twist. The tests for bow and twist shall be performed in accordance with test method number
2.4.22 of IPC-TM-650.
4.7.4.5 Rework simulation. The rework simulation test shall be performed in accordance with test method number
2.4.36 of IPC-TM-650.
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4.7.4.6 Solderability. The tests for hole or surface solderability shall be performed in accordance with J-STD-003.
The default category of coating durability of J-STD-003 is category 2. When required by the procurement
documentation, accelerated conditioning for coating durability shall be in accordance with J-STD-003.
4.7.5 Electrical test methods.
4.7.5.1 Continuity. A current shall be passed through each conductor or group of interconnected conductors by
applying electrodes on the terminals at each end of the conductor or group of conductors. The current passed
through the conductors shall not exceed those specified in the applicable design standard for the smallest conductor
in the circuit.
4.7.5.2 Isolation (circuit shorts). A test voltage shall be applied between all common portions of each conductor
pattern and all adjacent common portions of each conductor pattern. The test voltage shall be applied between
conductor patterns of each layer and the electrically isolated pattern of each adjacent layer. For manual testing the
test voltage shall be 200 volts minimum and shall be applied for a minimum of 5 seconds. When automated test
equipment is used, the minimum applied test voltage shall be the maximum rated voltage specified. If the maximum
rated voltage on the printed board is not specified, the test voltage shall be 40 volts minimum.
4.7.6 Environmental test methods.
4.7.6.1 Moisture and insulation resistance. The test for moisture and insulation resistance shall be performed in
accordance with class 3 of test method number 2.6.3 of IPC-TM-650. The initial and final insulation resistance shall
be greater than or equal to 500M ohm when measured at 500 volts (+10, -0 percent) DC.
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4.7.6.2 Thermal stress. The test for thermal stress shall be performed in accordance with condition A of test
method number 2.6.8 of IPC-TM-650.
4.7.6.3 Thermal shock. The test for thermal shock shall be performed in accordance with test method number
2.6.7.2 of IPC-TM-650 except that the temperature extremes shall be 65 degrees Celsius and +125 degree Celsius.
5. PACKAGING
5.1 Packaging requirement. The requirement for packaging shall be in accordance with MIL-PRF-31032.
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