MILPRF50884F
APPENDIX A
A.3.7.4.8 Rework simulation. Rework simulation is not applicable for printed wiring board designs that do not use
any plated through-holes for component attachment.
A.3.7.4.8.1 Grade R, types 1 and 5 with unsupported holes (bond strength). After undergoing the test specified in
A.4.8.4.8.1, the unsupported land shall withstand 5 pounds (2.27 Kg) pull or 500 lb/in (3.4 MPa), whichever is less.
A.3.7.4.8.2 Grade R, types 2, 3 and 4 with plated-through holes. After undergoing the test specified in A.4.8.4.8.2,
the type 2, 3 or 4 printed wiring board test specimens shall meet the following requirements:
a.
External visual and dimensional inspection: When inspected as specified in A.4.8.1, there shall be no
evidence of blistering or delamination in excess of that allowed in A.3.5.
b.
Internal visual and dimensional inspection: The printed wiring board test specimen shall be microsectioned
A.3.7.4.8.3 Grade U. Printed wiring boards designs requiring grade U rework simulation shall be subjected to only
the first solder cycle of the test routines specified in A.3.7.4.8.1 or A.3.7.4.8.2, as applicable.
A.3.7.4.9 Solderability. Solderability testing is applicable only on printed wiring board designs that require
soldering during circuit card assembly processes. Unless otherwise specified (see A.3.1.1), printed wiring board
designs that use compliant pin technology only for component attachment do not require solderability testing. Unless
otherwise specified, printed wiring board designs that use surface mount components only shall be tested for surface
solderability.
A.3.7.4.9.1 Hole (plated-through hole) solderability. After undergoing the test specified in A.4.8.4.9.1, the printed
wiring board test specimen shall conform to the accept/reject criterion (good wetting, pinholes, dewetting,
non-wetting) specified in JSTD003 class 3 or the solderability test methods described in appendix G of
MILPRF31032, as applicable.
A.3.7.4.9.2 Surface (or surface mount land) solderability. After undergoing the test specified in A.4.8.4.9.2, the
printed wiring board test specimen shall conform to the accept/reject criterion (good wetting, pinholes, dewetting,
non-wetting) specified in JSTD003 class 3 or the solderability test methods described in appendix G of
MILPRF31032, as applicable.
A.3.7.4.10 Solder mask cure. When tested as specified in A.4.8.4.10, the cured solder mask coating shall not
exhibit tackiness, blistering, or delamination.
A.3.7.4.11 Surface peel strength (types 3 and 4 foil laminated printed wiring boards). When tested as specified in
A.4.8.4.11, the surface conductor shall withstand a minimum peel strength greater than or equal to the "after thermal
stress" values for the corresponding copper foil profile as specified by either the applicable base material specification
or the master drawing. If no value for peel strength is listed in the base material specification or on the master
drawing for the copper foil used (as is the case with many low and very low profile or rolled-annealed foils), then a
value that is 50 percent of the standard profile copper foil shall be used. Unless otherwise specified (see A.3.1.1), the
peel strength values for base material thicknesses over .0197 inch (0.500 mm) specified by the base material
specification shall be used. This requirement is only applicable to foil laminated types 3 and 4 printed wiring boards
that have surface conductors or surface mount lands. Printed wiring boards with no external circuitry (external
terminal land or pads only) do not require peel strength testing.
33
For Parts Inquires submit RFQ to Parts Hangar, Inc.
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business