MIL-PRF-50884 Printed Wiring Board, Flexible Or Rigid-Flex, General Specification ForThis specification establishes the performance and qualification requirements for flexible and rigid-flex printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(appendix A or appendix B\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL�PRF�50884F

APPENDIX A

A.4.7.1.4.1 Corrective actions. Corrective actions shall be taken on the materials or processes, or both, as

warranted, and on all units of product which can be corrected and which were manufactured under essentially the

same conditions (materials, processes, and equipment), and which are considered subject to the same failure.

A.4.7.1.4.2 Noncompliance. If the lot or lots directly represented by the group B failure have been shipped, the

manufacturer shall notify the acquiring activity of the failure and shall recall the affected lot or lots for reinspection, if

possible. All other lots represented by extension of qualification by the failed group B sample are considered

noncompliant until a sample from the next most complex (see A.7.2) inspection lot passes group B inspection.

A.4.7.1.4.3 Reinstitution of group A inspection. After successful completion of group B reinspection, group A

inspection of product represented by the group B failure may be reinstituted.

A.4.7.1.5 Disposition of sample units. Sample units which have been subjected to group B shall be retained as

specified in A.3.9.

TABLE A�VIII. Group B inspection.

Test coupon by type 1/

Notes

Requirement

Method

Inspection

Paragraph

Types 1, 2 ,3, and 5

Type 4

Subgroup 1

Resistance to solvents

Rework simulation

Moisture and insulation resistance

Dielectric withstanding voltage

Subgroup 2

Surface peel strength

See A.4.8.3.2.1 for test specimen description and number of samples required.

The holes to be tested and inspected shall represent component holes used for through�hole mounting.

The test specimens shall be either test coupon "A" or holes from a production printed wiring board.

Dielectric withstanding voltage shall be performed after the moisture and insulation resistance test on the

same test coupon subjected to the moisture and insulation resistance test.

Test coupon "P" is detailed in appendix H. See A.4.7.1.2.1 for the number of samples required.