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MIL-PRF-50884 Printed Wiring Board, Flexible Or Rigid-Flex, General Specification ForThis specification establishes the performance and qualification requirements for flexible and rigid-flex printed wiring boards with or without plated through holes \(see 6.1\). Verification is accomplished through the use of one of two methods of product assurance \(appendix A or appendix B\). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

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MIL­PRF­50884F
APPENDIX A
TABLE A­VII. Group A inspection.
Test specimen 1/
Requirement Method
Sample plans 2/
Inspection
paragraph
paragraph
T1
T2
T3
T4
T5
Visual and dimensional
External visual and
Plan BH 3/ 4/
dimensional acceptability
PWB
PWB
PWB
PWB
PWB
Registration (method I)
Plan BJ/TJ see 6/
5/
5/
5/
DPA by microsection
6/
6/
6/
6/
See 6/
Non-stressed specimens
6/
See 6/ and 7/
Registration (method II)
6/
6/
Chemical
8/
Resistance to solvents
8/
8/
See 8/
8/
8/
Physical
9/
9/
9/
9/
9/
Plan BN/TN 9/
Adhesion, coverlayer
10/
10/
10/
10/
10/
Plan BN/TN 10/
Adhesion, legend
11/
11/
11/
11/
11/
Plan BH/TJ 3/
Adhesion, plating
G
G
G
G
G
Plan TJ 12/
Adhesion, solder mask
PWB
PWB
PWB
PWB
PWB
Plan BH 13/
Bow and twist
Solderability
See 6/ 14/
Hole
Plan BH/TJ 6/ 15/
Surface
Solder mask cure
Plan TJ 16/
Electrical
Circuit continuity
PWB
PWB
100 percent 17/
100 percent 17/
Circuit shorts
PWB
PWB
Environmental
See 6/
6/
6/
6/
6/
6/
Resistance to soldering
heat
1/
T1 designates a type 1 design; T2 designates a type 2 design; T3 designates a types 3 design; T4 designates a
type 4 design, and T5 designates a type 5 design; PWB means inspect the entire production printed wiring board,
whereas an individual test coupon designation means inspect the specified test coupon. See appendix D herein
for test coupon identification (name) translation to the applicable design standard.
See appendix C, table C­I for C = 0 sampling plans and C.4.5 for examples.
2/
3/
Some attributes may need to be inspected prior to lamination or solder mask application.
4/
The solder mask thickness test can be performed on either a test coupon at a sampling of TJ or production printed
wiring board at a sampling of BH, manufacturer's option.
5/
Test coupon "A" or a production printed wiring board shall be used at the manufacturer s option.
6/
See A.4.6.2.2 for test specimen description and sample size. Type 1 test specimens do not require a DPA by
microsection evaluation.
7/
An optional method of verifying registration using test coupons (method III) is available. See A.4.8.2.4.2 for
details.
8/
See A.4.8.3.2.1 for test specimen description and sample size.
9/
See A.4.8.4.1 for test specimen description.
10/
See A.4.8.4.2 for test specimen description.
11/
Test coupons "C", "M", or a production printed wiring board shall be used at the manufacturer s option.
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